Technical Library: heller working time (Page 2 of 4)

Printing and Curing of Conductive Ink Track on Curvature Substrate using Fluid Dispensing System and Oven

Technical Library | 2017-12-21 11:24:05.0

The present work concerns on the use of sensors to monitor the structural health of wind turbine . Conventionally the inspection was made using non-contact sensing during the turbine’s inoperable period hence loss occurred. A real -time monitoring system via embedded wireless sensor is preferred but the sensor could only be implanted using non-contact printing method due to most turbine blade s’ curved surface. Conductive ink associate d with non-contact printing method via fluid dispensing system are proposed since conductive inks are proven stretchable and fluid dispensing system enables printing on various substrates and works well with any materials...

University of Tun Hussein Onn

Database Driven Multi Media Work Instructions

Technical Library | 2019-03-25 12:45:56.0

Work instructions are time consuming to generate for engineers, often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail, with varying guidelines, for multiple stations, operators and lines. Minor component, station or process changes – down to the modification of an individual BOM component – can cause headaches when attempting to maintain consistency across multiple work instructions that are touched by the change.The solution presented here improves efficiency and saves engineering time by making use of a database driven approach. Manufacturing details, component information, process guidelines, annotations, machine-specific data, and more can be stored in one central database. Any information stored in this single repository can then be modified quickly in one location and automatically propagate seamlessly throughout multiple work instructions. These can be instantly printed out or displayed on screens at appropriately affected stations with the simple click of a button, as opposed to regenerating from scratch, or going in and reviewing many documents to find and update with the change.

Optimal Electronics Corporation

QPlan - NPI Tools included

Technical Library | 2018-10-29 05:03:59.0

We found that NPI process of SMT is mostly similar and sometimes overlapping to tooling process. In addition, in most cases the programmer is part of the team working on the NPI process. So, QPlan was extended with NPI Tools as a part of tooling process. This allows the team to carry out the NPI process at offline. And at the end of it, they can create corrected SMT program at zero time.

Proventus Technologies

Package-on-Package (PoP) Warpage Characteristic and Requirement

Technical Library | 2021-12-16 01:48:41.0

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI has been working relentlessly to fingerprint the current PoP package technology warpage characteristic and to establish some key learning for packaging technologies. The work also extended to understand the basic requirement needed for successful PoP stacking by analyzing the warpage data obtained and formulate a simple analytical equation to explain the true warpage requirement for PoP packaging.

Intel Corporation

What causes temperature humidity chamber to alarm?

Technical Library | 2019-12-12 02:43:44.0

Today we discuss the reason that causes temperature humidity chamber to alarm,In most cases, the equipment alarm is caused by the improper operation in the process of use, which mainly includes following reasons:that are refrigeration system, temperature system and circulating system. First, Refrigeration system 1, refrigeration compressor overpressure alarm. If the refrigerant pressure exceeds the set value, it will stop and alarm at the same time. At this time, the fault must be eliminated and then manually reset. 2, short phase power supply, phase sequence alarm. When the external power supply of the equipment is out of phase or the phase sequence is changed, it will stop and alarm at the same time. 3. The circulating cooling water is short of water to alarm. When the water pressure of the cooling circulating water system is insufficient, it will stop and alarm at the same time, and it must wait for the fault to be eliminated and reset at the same time before it could run normally. 4, refrigeration compressor overheating alarm. When the coil of the compressor is overheated and the power supply of the line is not normal, it will stop and alarm at the same time. Second, Temperature system 1, the overtemperature alarm in the chamber. The sensors in the channel and the sample area are equipped with overtemperature protection devices, and there are also overtemperature protecter on the control panel. When the temperature in the working chamber exceeds the setting value on the controller, it will stop and alarm. 2. sample overtemperature protection. When the temperature in the sample area exceeds the protection temperature set by the controller, it will stop and alarm at the same time. The overtemperature protection of the sample is divided into upper limit protection and lower limit protection, which can be set according to the demand, Third,Circulating system 1. The alarm is caused by the overheating of the circulating fan. When the coil of the fan is over-heated, the alarm will be stopped at the same time. 2. The fan over-current alarm. When the current of the fan exceeds the allowable value, the alarm is stopped at the same time, and the normal operation can only be carried out after the fault maintenance of the overcurrent is completed. This is what we talk about today,if you have more questions,let us know.

Symor Instrument Equipment Co.,Ltd

Environmentally Certified Technologies: A Case Study

Technical Library | 2000-06-21 17:55:59.0

There was once a time when precision cleaning required minimal thought. Just about anything that was dirty could be placed inside a vapor degreaser and emerge clean and dry in a matter of minutes. Today, precision cleaning decisions are seemingly endless with ever-changing environmental regulations, user safety issues and product compatibility concerns. Technologies range from spray-in-atmosphere to ultrasonics to spray under immersion using aqueous, solvent or semiaqueous chemistries. Which method works and with what chemistry? Will the process be safe or even allowed by the regulating agencies?

Smart Sonic Stencil Cleaning Systems

How does IPX9K Rain Test Chamber Works?

Technical Library | 2019-05-08 01:46:32.0

IPX9K Rain Spray Test Chamber(high Pressure high temperature water jet) simulates the use of pressure washer steam cleaning onto the enclosure, It is recognised as the harshest of all ingress protection tests. However the requirement is becoming more prevalent across many industries. Test method for IPX9K : Make sure the water temperature inside the water tank +80°C, water flow rate with 14L-16L per min, water pressure: 8000 Kpa -10000 Kpa (80–100 bar) at distance of 100mm~ 150mm, The test duration is 30 seconds in each of 4 angles, total spray testing time is 2 minutes. IPX9K rain test chamber applicable standards: IEC 60529 – Degrees of protection provided by enclosures (IP Code).Here is working principle in picture. Application: It is mainly suitable for testing the performance of shell and seal of electrical and electronic parts, automobile parts and seals under the condition of dripping rain to prevent Rain Water from permeating or working after drizzling.

Symor Instrument Equipment Co.,Ltd

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

Technical Library | 2007-08-09 12:23:10.0

Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.

Universal Instruments Corporation

A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive - Capillary Underfill Replacement

Technical Library | 2016-01-12 11:07:56.0

With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process.

YINCAE Advanced Materials, LLC.

Automated Optical Inspection Method for Light-Emitting Diode Defect Detection Using Unsupervised Generative Adversarial Neural Network

Technical Library | 2021-11-22 20:44:44.0

Many automated optical inspection (AOI) companies use supervised object detection networks to inspect items, a technique which expends tremendous time and energy to mark defectives. Therefore, we propose an AOI system which uses an unsupervised learning network as the base algorithm to simultaneously generate anomaly alerts and reduce labeling costs. This AOI system works by deploying the GANomaly neural network and the supervised network to the manufacturing system. To improve the ability to distinguish anomaly items from normal items in industry and enhance the overall performance of the manufacturing process, the system uses the structural similarity index (SSIM) as part of the loss function as well as the scoring parameters. Thus, the proposed system will achieve the requirements of smart factories in the future (Industry 4.0).

Shenzhen University


heller working time searches for Companies, Equipment, Machines, Suppliers & Information

Heller Industries Inc.
Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Manufacturer

4 Vreeland Rd.
Florham Park, NJ USA

Phone: 973-377-6800

Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
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