Technical Library: herald electronics limited (Page 1 of 6)

A Review of Corrosion and Environmental Effects on Electronics

Technical Library | 2013-08-01 13:17:44.0

Electronic industry uses a number of metallic materials in various forms. Also new materials and technology are introduced all the time for increased performance. In recent years, corrosion of electronic systems has been a significant issue. Multiplicity of materials used is one reason limiting the corrosion reliability. However, the reduced spacing between components on a printed circuit board (PCB) due to miniaturization of device is another factor that has made easy for interaction of components in corrosive environments. Presently the knowledge on corrosion issues of electronics is very limited. This paper reviews briefly the materials used in electronic systems, factors influencing corrosion, types of corrosion observed in electronics, and testing methods.

Technical University of Denmark

The Future of Solid-State Electronics

Technical Library | 1999-05-06 13:44:43.0

This paper explores the direction in which IC technology is headed, highlights potential roadblocks and possible solutions, and discusses some of the physical considerations that could determine the ultimate limits of integration.

Alcatel-Lucent

Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics

Technical Library | 2020-02-19 23:12:55.0

Silver nanowires (Ag NWs) possess excellent optoelectronic properties, which have led to many technology-focused applications of transparent and flexible electronics. Many of these applications require patterning of Ag NWs into desired shapes, for which mask-based and printing-based techniques have been developed and widely used. However, there are still several limitations associated to these techniques. These limitations, such as complicated patterning procedures, limited patterning area, and compromised optical transparency, hamper the efficient fabrication of high-performance Ag NW patterns. Here, we propose a coat-and-print approach for effectively patterning Ag NWs.

Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab

Comparison of Testing Methods for Residues on Electronic Hardware

Technical Library | 2023-12-26 17:50:54.0

In this white paper, we discuss the pros and cons of five analytical techniques when applied to residue analysis on electronic assemblies. We evaluate the following for their application and limitations for analyzing both visible and invisible residues: FITR, SEM/EDX, XRF, Ion Chromatography, and ROSE

Foresite Inc.

Test Solution for Heatsinks in Power Electronics Applications

Technical Library | 2021-03-24 01:30:47.0

Power electronics technology is widely used in several areas, such as in the railways, automotive, electric vehicles, and renewable energy sectors. Some of these applications are safety critical, e.g., in the automotive domain. The heat produced by power devices must be efficiently dissipated to allow them to work within their operational thermal limits. Moreover ...

Politecnico di Torino

WHY test for Ionic Contamination?

Technical Library | 2023-04-17 21:37:32.0

Ionic contamination is a leading cause in the degradation and corrosion of electronic assemblies, leading to lifetime limitation and field failure (Fig. 1). Ionic residue comes from a variety of sources shown in Fig. 2 opposite: Examples of ionic contaminants: * Anions * Cations * Weak Organic Acid

Specialty Coating Systems

Duo-Solvent Cleaning Process Development for Removing Flux Residue from Class 3 Hardware

Technical Library | 2016-07-28 17:00:20.0

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported.

KYZEN Corporation

Screening for Counterfeit Electronic Components

Technical Library | 2010-03-11 19:33:47.0

Counterfeit products have been a growing problem worldwide, and the electronics industry has been no exception. Authentication of electronic components by electrical and physical testing can provide a cost-effective means of risk management, aimed at keeping counterfeits out of the supply chain. In this presentation, we will review sources of counterfeit components, and discuss the capabilities and limitations of test processes used for authentication. We will then present examples of component authentication using these tools.

Process Sciences, Inc.

Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques

Technical Library | 2016-04-28 14:43:23.0

Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic applications. Its usage is currently spreading across the industry fueled by the decreasing reliability margins induced by the miniaturization and interconnect pitch reduction. (...) This paper will address the control of surface mount under filled assemblies, focusing on applicable inspection techniques and possible options to overcome their limitations.

THALES

Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices"

Technical Library | 2021-09-01 15:31:39.0

The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.

Plexus Corporation

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