Technical Library: high voltage detector (Page 1 of 2)

Novel Pogo-Pin Socket Design for Automated Low Signal Linearity Testing of CT Detector Sensor

Technical Library | 2019-01-30 21:20:47.0

Due to the arrayed nature of the Computed Tomography (CT) Detector, high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically, the detector module sensor element, hereby known as the Multi-chip module (MCM), has a 544 position BGA area array pattern that requires precise test stimulation. A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data. (...) This paper and presentation will focus on the socket design challenges and also key learnings from the design that can be applied to general test systems, including reliability testing. The secondary focus will be on the overall data collection and graphical user interface for the test equipment.

General Electric

High Voltage Chip Resistors

Technical Library | 2010-10-21 16:01:17.0

Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level of conventional high voltage resistors which are generally availab

Ohmcraft

Thermal Management of Electrolytic Capacitors

Technical Library | 1999-05-06 12:08:08.0

Input voltage capacitors are typically the parts that fail first in a high power circuit. Today's requirements for increasingly smaller packages is driving high component densities in power systems, as in all systems. As the package size...

Aavid Thermalloy, LLC

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

Technical Library | 2009-10-08 01:58:04.0

In the present study, we report novel ferroelectric-epoxy based polymer nanocomposites that have the potential to surpass conventional composites to produce thin film capacitors over large surface areas, having high capacitance density and low loss. Specifically, novel crack resistant and easy to handle Resin Coated Copper Capacitive (RC3) nanocomposites capable of providing bulk decoupling capacitance for a conventional power-power core, or for a three layer Voltage-Ground-Voltage type power core, is described.

i3 Electronics

How to Control Speed of Servo Motor & Anti-Interference Measures

Technical Library | 2021-12-31 01:27:08.0

A servomotor refers to the actuator to control the operation of mechanical components in the servo system and is a subsidy motor indirect transmission device. The servo motor can control speed, whose position accuracy is high, and convert voltage signal into torque and speed to drive the controlled object. A servomotor speed is controlled by the input signal, responding quickly.

OKmarts Industrial Parts Mall

Test Structures for Benchmarking the Electrostatic Discharge (ESD) Robustness of CMOS Technologies

Technical Library | 1999-08-05 10:34:17.0

This document defines a set of standard test structures with which to benchmark the electrostatic discharge (ESD) robustness of CMOS technologies. The test structures are intended to be used to evaluate the elements of an integrated circuit in the high current and voltage ranges characteristic of ESD events. Test structures are given for resistors, diodes, MOS devices, interconnects, silicon control rectifiers, and parasitic devices. The document explains the implementation strategy and the method of tabulating ESD robustness for various technologies.

SEMATECH

A Review of Models for Time-to-Failure Due to Metallic Migration Mechanisms

Technical Library | 2009-10-14 21:17:47.0

Electrochemical migration (ECM) is defined as the growth of conductive metal filaments across a printed circuit board (PCB) in the presence of an electrolytic solution and a DC voltage bias. ECM, also known as dendritic growth, is a critical issue in the electronics industry because the intermittent failure behavior of ECM is a likely root-cause of the high occurrence of field failures identified as no trouble found (NTF)/could not duplicate (CND)

DfR Solutions

Conductive Anodic Filament: Mechanisms and Affecting Factors

Technical Library | 2021-07-27 14:49:16.0

Conductive anodic filament (CAF) formation, a failure mode in printed wiring boards (PWBs) that are exposed to high humidity and voltage gradients, has caused catastrophic field failures. CAF is an electrochemical migration failure mechanism in PWBs. In this article, we discuss CAF, the factors that enhance it, and the necessary conditions for its occurrence. Published studies are discussed, and the results of historical mean time to failure models are summarized. Potential reasons for CAF enhancement solutions are discussed, and possible directions in which to develop anti-CAF materials are proposed.

Hong Kong Polytechnic University [The]

Material & Process Influences on Conductive Anodic Filamentation (CAF)

Technical Library | 2023-03-16 19:07:51.0

HISTORY: * In the late 1970s an abrupt unpredictable loss of insulation resistance was observed in PCBs, which were subject to hostile climatic conditions of high relative humidity and temperature while having an applied voltage. * The loss of resistance, even leading to a short circuit was observed to be due to the growth of a subsurface filament from the anode to the cathode. * The term "Conductive Anodic Filamentation" (CAF) was coined.

Isola Group

Design and Integration of aWireless Stretchable Multimodal Sensor Network in a Composite Wing

Technical Library | 2020-10-08 00:55:22.0

This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor "islands" connected by interconnecting "serpentines." A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge(SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c)configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication.

Stanford University

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