Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Technical Library | 2018-04-27 12:59:29.0
Hot Air and IR are the two main types of rework stations used by OEMs and PCB contract manufacturers today. Both have advantages and disadvantages and choosing the right one for your application requires a careful consideration of a number of factors, including your budget, your working requirements and the capabilities of your staff. In this article, we outline some of the differences between hot air and IR BGA rework stations.
Technical Library | 2023-11-22 09:17:49.0
In the dynamic realm of Industry 4.0, I.C.T introduces the I.C.T-T550 SMT PCB coating machine, a pioneering addition designed to meet the evolving needs of modern manufacturing. This advanced equipment is equipped with features that not only boost productivity but also prioritize precise and consistent coating quality. Let's delve into the crucial attributes that establish the I.C.T-T550 as a vital component in your production process. 1. Automated Precision for Coating Consistency The I.C.T-T550 PCB Coating Machine integrates an automated pressure regulation system for both dispensing valve and pressure tank, equipped with precision regulators and digital gauges. This ensures a consistent coating process, optimizing precision. 2. Front-End Accessibility for Operational Efficiency Located at the front end, power supply and air pressure adjustments are easily accessible, streamlining control. This user-friendly design enhances operator workflow efficiency. 3. Durable Material Transport The open-material transport rail undergoes hardening treatment and utilizes a specialized stainless steel chain drive, ensuring both longevity and reliable material transport. 4. Track Width Adjustment for Trouble-Free Operation Track width adjustment is achieved through a synchronous belt drive mechanism, ensuring prolonged and trouble-free operation. 5. CNC Machined Frame for Unparalleled Precision The machine's frame, subjected to CNC machining, features an independent, all-steel gantry frame, ensuring the parallel alignment of tracks and axes. 6. Workshop Environment Enhancement To ensure a cleaner and safer workspace, the equipment features air curtains at the track entrance and exit, preventing fumes from escaping. It also includes a dedicated exhaust outlet, improving overall workshop air quality. 7. Intuitive Programming and Visualization The I.C.T-T550 PCB Coating Machine allows flexible coating path editing through intuitive programming. The equipment employs a teach mode for programming, offering a visual interface for coating path design. 8. User-Friendly Interface with Practical Design Featuring a user-friendly interface with fault alerts and menu displays, the I.C.T-T550 delivers a sleek and practical design. 9. Streamlined Repetition and Data Management Efficiency is paramount, and the I.C.T-T550 offers the ability to mirror, array, and replicate coating paths, simplifying the process, especially with multiple boards. 10. Real-Time Data Monitoring The equipment automatically collects and displays data, including production volume and individual product work times, enabling effective production performance tracking. 11. Smart Adhesive Management The I.C.T-T550 intelligently monitors adhesive levels, providing automatic alerts for replenishment, ensuring uninterrupted coating. In summary, the I.C.T SMT PCB coating machine seamlessly combines precision, automation, and smart features to meet the demands of Industry 4.0. With integration into MES systems, it provides a reliable and efficient solution for elevating PCB coating processes. The I.C.T-T550's adherence to European safety standards and CE certification underscores our commitment to safety and compliance. For further inquiries or information about additional safety standards, please contact us. Whether optimizing coating quality or enhancing factory productivity, the I.C.T-T550 marks a step into the future of intelligent manufacturing. Explore a variety of coating valves or seek guidance by reaching out to us.
Technical Library | 2019-09-25 04:36:01.0
What is the main function of hot air dry oven? Drying ovens are devices used to remove moisture and other solvents from the items placed inside them through a forced convection process, collecting it elsewhere so that the object becomes dehydrated. A drying oven causes objects to dry out through evaporation. Drying ovens use convection heating,also called air forced, in which the object is heated through air currents. Water from the object escapes into the air, raising the humidity level and causing the semi-solid membranes inside the oven to absorb the water. The end result is that the oven removes water from the object being dried, leaving it dehydrated. Drying ovens contain a system for forcing convection currents to develop, usually either a fan or turbine, which aids in the heating and drying process by ensuring that the hot air circulates,many ovens are equipped with an adjustable ventilation system that allows the user to ensure that the system has an adequate air supply. For details,pls visit our website: https://climatechambers.com/articles&latestnews/what-is-the-main-function-of-hot-air-dry-oven.html
Technical Library | 1999-08-09 11:09:42.0
Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements.
Technical Library | 1999-08-09 11:11:55.0
A great deal of controversy continues to surround the use of Hot Air Solder Leveling (HASL) in the production of printed circuit boards (PCBs). The financial burden, technological limitations and environmental issues surrounding the HASL process continue to grow. This requires an in-depth review by the printed circuit board manufacturing plant, as well as the assembly operation and instrument designers ( OEMs), to determine what alternative surface finishes are appropriate.
Technical Library | 2021-07-06 21:13:36.0
The surface finishes commonly used on printed circuit boards (PCBs) have an effect on solder paste performance in the surface mount process. Some surface finishes are non-planar like hot air solder level (HASL) which can lead to inconsistencies in solder paste printing. Other surface finishes are difficult to wet during reflow like organic solderability preservative (OSP). What is the overall effect of surface finish on solder paste performance? Which solder paste is best for each surface finish? It is the goal of this paper to answer these questions.
Technical Library | 2021-10-20 18:21:06.0
The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.
Technical Library | 2023-03-16 18:51:43.0
Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices.
Technical Library | 2016-11-10 17:37:35.0
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data center total cost of ownership. Free-air cooling is one of the industrial trends in reducing power consumption, the power usage effectiveness (PUE) ratio, and the total cost of ownership (TCO). Free-air cooling is a viable approach in many parts of the world where the air is reasonably clean. In Eastern China, the poor quality of air, high in particle and gaseous contamination, is a major obstacle to free-air cooling. Servers exposed to outside air blowing in to data centers will corrode and fail at high rate. The poor reliability of hardware increase TCO dramatically. This paper describes a corrosion resistant server design suitable for reliable operation in a free-air cooling data center located in Eastern China where the indoor air quality can be as poor as ASHRAE (American Society of Heating, Refrigerating and Air-Conditioning Engineers) severity level G3. An accelerated corrosion test method of verifying hardware reliability in the ASHRAE severity level G3 environment is also described.
