Technical Library: hs 50 displaced components (Page 1 of 1)

The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.

Technical Library | 2008-04-29 15:50:45.0

The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies

Rockwell Collins

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