Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2012-06-07 21:44:28.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. IPC-175x Intent: To establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain.
Technical Library | 2023-11-14 02:36:41.0
Understanding In-Circuit Testing (ICT) with PCBA ICT Testing Machine In-Circuit Testing, commonly known as ICT, stands as a sophisticated and precise method within electronics manufacturing. It serves to evaluate the functionality and integrity of individual electronic components on a Printed Circuit Board (PCB). The process employs specialized equipment called ICT Testers, meticulously designed to pinpoint defects, shorts, opens, and other potential issues within the PCB assembly. The Crucial Role of PCBA ICT Testing Machine 1. Quality Assurance ICT is pivotal in ensuring the overall quality and reliability of electronic products. Early identification and rectification of defects in the production process help manufacturers avoid costly recalls, rework, and post-production issues. 2. Cost-Efficiency ICT significantly reduces manufacturing costs by identifying defects at an early stage. This results in fewer defective units reaching the end of the production line, minimizing waste and rework. 3. Faster Time-to-Market Manufacturers can expedite the production process with ICT by swiftly identifying and resolving issues. This leads to faster product launches, providing a competitive edge in the market. Unveiling the Functions of PCBA ICT Testing Machine The ICT Tester, the core of the In-Circuit Testing process, conducts a battery of tests on each PCB, including: 1. Continuity Testing Checks for open circuits, ensuring all connections are properly established. 2. Component Verification Verifies the presence and orientation of components, ensuring alignment with the PCB design. 3. Functional Testing Some ICT Testers execute functional tests, assessing electronic components' performance as per specifications. 4. Short Testing Identifies unintended connections or shorts between different components on the PCB. 5. Insulation Testing Checks for isolation between different circuits, ensuring no undesired connections or paths. 6. Programming and Configuration In some cases, ICT Testers are used to program and configure specific components on the PCB. Advantages of PCBA ICT Testing Machine 1. High Precision ICT offers unparalleled accuracy in defect detection, making it crucial in modern electronics manufacturing. 2. Speed and Efficiency ICT Testers enable rapid testing, allowing manufacturers to assess a large number of PCBs in a short time. 3. Customization ICT Tests can be tailored to suit specific PCB requirements, ensuring thorough evaluation of every design aspect. 4. Data Collection ICT Testers gather valuable data for process optimization and quality control. In-Circuit Testing (ICT) is fundamental in electronics manufacturing, safeguarding product quality, reducing costs, and accelerating time-to-market. The ICT Tester, with its precision and efficiency, positions manufacturers at the forefront of the highly competitive electronics industry. Embracing ICT is not just a choice; it's a necessity for manufacturers striving for excellence in their products. I.C.T is a leading manufacturer of full SMT line machines in the electronic manufacturing industry. Discover how we can enhance product quality, boost performance, and reduce costs. Contact us at info@smt11.com for reliable global supply, unparalleled efficiency, and superior technical service.
Technical Library | 2023-11-22 09:17:49.0
In the dynamic realm of Industry 4.0, I.C.T introduces the I.C.T-T550 SMT PCB coating machine, a pioneering addition designed to meet the evolving needs of modern manufacturing. This advanced equipment is equipped with features that not only boost productivity but also prioritize precise and consistent coating quality. Let's delve into the crucial attributes that establish the I.C.T-T550 as a vital component in your production process. 1. Automated Precision for Coating Consistency The I.C.T-T550 PCB Coating Machine integrates an automated pressure regulation system for both dispensing valve and pressure tank, equipped with precision regulators and digital gauges. This ensures a consistent coating process, optimizing precision. 2. Front-End Accessibility for Operational Efficiency Located at the front end, power supply and air pressure adjustments are easily accessible, streamlining control. This user-friendly design enhances operator workflow efficiency. 3. Durable Material Transport The open-material transport rail undergoes hardening treatment and utilizes a specialized stainless steel chain drive, ensuring both longevity and reliable material transport. 4. Track Width Adjustment for Trouble-Free Operation Track width adjustment is achieved through a synchronous belt drive mechanism, ensuring prolonged and trouble-free operation. 5. CNC Machined Frame for Unparalleled Precision The machine's frame, subjected to CNC machining, features an independent, all-steel gantry frame, ensuring the parallel alignment of tracks and axes. 6. Workshop Environment Enhancement To ensure a cleaner and safer workspace, the equipment features air curtains at the track entrance and exit, preventing fumes from escaping. It also includes a dedicated exhaust outlet, improving overall workshop air quality. 7. Intuitive Programming and Visualization The I.C.T-T550 PCB Coating Machine allows flexible coating path editing through intuitive programming. The equipment employs a teach mode for programming, offering a visual interface for coating path design. 8. User-Friendly Interface with Practical Design Featuring a user-friendly interface with fault alerts and menu displays, the I.C.T-T550 delivers a sleek and practical design. 9. Streamlined Repetition and Data Management Efficiency is paramount, and the I.C.T-T550 offers the ability to mirror, array, and replicate coating paths, simplifying the process, especially with multiple boards. 10. Real-Time Data Monitoring The equipment automatically collects and displays data, including production volume and individual product work times, enabling effective production performance tracking. 11. Smart Adhesive Management The I.C.T-T550 intelligently monitors adhesive levels, providing automatic alerts for replenishment, ensuring uninterrupted coating. In summary, the I.C.T SMT PCB coating machine seamlessly combines precision, automation, and smart features to meet the demands of Industry 4.0. With integration into MES systems, it provides a reliable and efficient solution for elevating PCB coating processes. The I.C.T-T550's adherence to European safety standards and CE certification underscores our commitment to safety and compliance. For further inquiries or information about additional safety standards, please contact us. Whether optimizing coating quality or enhancing factory productivity, the I.C.T-T550 marks a step into the future of intelligent manufacturing. Explore a variety of coating valves or seek guidance by reaching out to us.
Technical Library | 2024-02-26 09:08:23.0
Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology.
Technical Library | 2023-12-27 12:27:29.0
Background Of SMT Auto IC Programming Machines In the dynamic landscape of electronics manufacturing, SMT Auto IC Programming Machines, also known as IC Programmers, have become indispensable tools. These machines play a crucial role in the semiconductor industry, addressing the escalating demand for efficient programming tools as electronic devices become more intricate. Specifically designed to load firmware or programs onto integrated circuits (ICs), these machines ensure the functionality of ICs and facilitate their seamless integration into various electronic applications. Significance Of SMT Auto IC Programming Machines The significance of SMT Auto IC Programming Machines lies in their ability to streamline the manufacturing process of electronic devices. ICs, ranging from microcontrollers to memory chips, serve as the central processing units in electronic systems. IC Programming Machines enable the customization of these ICs, allowing manufacturers to program specific functionalities, update firmware, and adapt to diverse applications. Furthermore, these machines contribute significantly to the rapid development of new products. In a market where time-to-market is critical, IC Programming Machines provide the flexibility to quickly program different ICs, reducing production lead times and enhancing overall efficiency. Operational Principles Of IC Programming Machines Hardware Architecture SMT Auto IC Programming Machines consist of a sophisticated hardware architecture comprising a controller, socket, pin detection system, and additional peripherals. The controller acts as the brain, orchestrating the programming process, while the socket provides a connection interface for the IC. Programming Algorithms At the core of IC Programming Machines are various programming algorithms encompassing essential operations such as erasure, writing, and verification. The choice of algorithms depends on the specific requirements of the IC and the desired functionality. Communication Protocols Effective communication between the IC Programming Machine and the target IC is facilitated by standardized communication protocols such as JTAG, SPI, and I2C. The selection of a particular protocol is influenced by factors such as data transfer speed, complexity, and compatibility with the IC. Advanced Features And Characteristics Equipped with advanced features like parallel programming, support for multiple ICs, and online programming, IC Programming Machines elevate their capabilities, enhancing production efficiency and flexibility. Practical Applications IC Programming Machines find practical applications across various industries, from automotive electronics to consumer electronics. Case studies illustrate how these machines contribute to improved production workflows and product quality by ensuring programmed ICs meet specific application requirements. Future Trends Looking ahead, the future of SMT Auto IC Programming Machines holds exciting prospects. Anticipated trends include advancements in programming speed, support for emerging communication protocols, and increased integration with smart manufacturing systems. These developments aim to address the evolving demands of the electronics industry. I.C.T-910 Programming Machine Invest in the I.C.T-910 for an efficient and reliable IC programming experience. The I.C.T-910 complies with European safety standards, holding a CE certificate that attests to its quality and adherence to safety regulations. Our skilled engineers at I.C.T are committed to ensuring your success by providing professional training and assistance with equipment installation. I.C.T: Your Comprehensive SMT Equipment Provider I.C.T stands as a comprehensive SMT equipment provider, offering end-to-end solutions for your SMT production line needs. Tailoring services to your specific requirements and product specifications, we conduct a thorough analysis to determine the precise SMT equipment that suits your needs. Our commitment is to deliver the highest quality and cost-effective solutions, ensuring optimal performance and efficiency for your production processes. Partner with I.C.T for a customized approach to SMT equipment that aligns perfectly with your manufacturing goals. Contact us for an inquiry today.
Technical Library | 2013-06-05 14:09:42.0
Quality standards are getting tougher each year. In these difficult times, wire harness manufacturers are looking to expand business in their existing markets and are looking for new markets. The following article will compare and contrast the current quality standards that are most commonly used today. It will review proper measurement techniques, discuss some trends in crimp quality, and address methods to improve efficiency in quality data collection.
Technical Library | 2017-04-24 18:24:42.0
The process of taking a design from schematic to actual working prototype is a complex one, however, and proper documentation is the best way to simplify it.
