Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2024-08-09 06:34:09.0
Quality control in conformal coating applications is vital for ensuring the reliability and longevity of electronic products. Conformal coatings protect printed circuit boards (PCBs) from environmental factors like moisture, dust, and chemicals. To maintain high standards, various inspection methods are employed throughout the coating process. Visual Inspection This is the first line of defense against defects. Inspectors look for uniform coverage, absence of bubbles, and proper curing. Training is essential to ensure that inspectors can identify subtle issues that may affect performance. UV Inspection Most conformal coatings contain a UV tracer, which makes the coating visible under ultraviolet light. UV inspection allows for easy detection of missed areas, ensuring complete coverage. This step is crucial for verifying that the coating has been applied correctly, especially in hard-to-see areas of the PCB. Automated Optical Inspection (AOI) AOI systems offer a more precise and consistent method for inspecting conformal coatings. They use cameras and specialized software to detect defects that might be missed by the human eye. AOI systems can inspect large volumes of PCBs quickly, making them ideal for high-production environments. Thickness Measurement The thickness of the conformal coating is critical for providing adequate protection without affecting the performance of the PCB. Tools such as micrometers, ultrasonic thickness gauges, and eddy current devices are used to measure the coating thickness. Consistent application is key to preventing issues like cracking or insufficient protection. Functional Testing Beyond visual and automated inspections, functional testing is necessary to ensure that the conformal coating does not interfere with the electrical performance of the PCB. This involves subjecting the coated PCB to environmental stress tests, such as thermal cycling, humidity, and salt spray, to assess its reliability in real-world conditions. Process Control and Documentation Implementing strict process controls is essential to maintaining quality. This includes regularly calibrating equipment, training operators, and documenting every step of the process. Proper documentation helps trace issues back to their source and prevents them from recurring. Conclusion Effective quality control in conformal coating applications ensures that PCBs are protected from environmental damage, thereby extending their lifespan and reliability. By employing a combination of visual, UV, and automated inspections, along with thickness measurement and functional testing, manufacturers can achieve the highest standards in coating quality.
Technical Library | 2023-11-14 02:36:41.0
Understanding In-Circuit Testing (ICT) with PCBA ICT Testing Machine In-Circuit Testing, commonly known as ICT, stands as a sophisticated and precise method within electronics manufacturing. It serves to evaluate the functionality and integrity of individual electronic components on a Printed Circuit Board (PCB). The process employs specialized equipment called ICT Testers, meticulously designed to pinpoint defects, shorts, opens, and other potential issues within the PCB assembly. The Crucial Role of PCBA ICT Testing Machine 1. Quality Assurance ICT is pivotal in ensuring the overall quality and reliability of electronic products. Early identification and rectification of defects in the production process help manufacturers avoid costly recalls, rework, and post-production issues. 2. Cost-Efficiency ICT significantly reduces manufacturing costs by identifying defects at an early stage. This results in fewer defective units reaching the end of the production line, minimizing waste and rework. 3. Faster Time-to-Market Manufacturers can expedite the production process with ICT by swiftly identifying and resolving issues. This leads to faster product launches, providing a competitive edge in the market. Unveiling the Functions of PCBA ICT Testing Machine The ICT Tester, the core of the In-Circuit Testing process, conducts a battery of tests on each PCB, including: 1. Continuity Testing Checks for open circuits, ensuring all connections are properly established. 2. Component Verification Verifies the presence and orientation of components, ensuring alignment with the PCB design. 3. Functional Testing Some ICT Testers execute functional tests, assessing electronic components' performance as per specifications. 4. Short Testing Identifies unintended connections or shorts between different components on the PCB. 5. Insulation Testing Checks for isolation between different circuits, ensuring no undesired connections or paths. 6. Programming and Configuration In some cases, ICT Testers are used to program and configure specific components on the PCB. Advantages of PCBA ICT Testing Machine 1. High Precision ICT offers unparalleled accuracy in defect detection, making it crucial in modern electronics manufacturing. 2. Speed and Efficiency ICT Testers enable rapid testing, allowing manufacturers to assess a large number of PCBs in a short time. 3. Customization ICT Tests can be tailored to suit specific PCB requirements, ensuring thorough evaluation of every design aspect. 4. Data Collection ICT Testers gather valuable data for process optimization and quality control. In-Circuit Testing (ICT) is fundamental in electronics manufacturing, safeguarding product quality, reducing costs, and accelerating time-to-market. The ICT Tester, with its precision and efficiency, positions manufacturers at the forefront of the highly competitive electronics industry. Embracing ICT is not just a choice; it's a necessity for manufacturers striving for excellence in their products. I.C.T is a leading manufacturer of full SMT line machines in the electronic manufacturing industry. Discover how we can enhance product quality, boost performance, and reduce costs. Contact us at info@smt11.com for reliable global supply, unparalleled efficiency, and superior technical service.
Technical Library | 2019-05-31 14:19:24.0
ACI Technologies (ACI) characterized the reliability of surface mount RF components. The RF frequency band of interest was the X band (10.7 to 11.7GHz). A two pronged test for reliability of circuit card assemblies (CCA) was designed for both extreme thermal cycling and vibration. The rapid thermal cycling and extreme vibration testing simulates the total stress encountered by the assembly over the life of the product but accomplishes it in a relatively short period of time. In order to perform the reliability testing, a test vehicle consisting of a printed circuit board with test structures and components, was designed, fabricated, and assembled at ACI.
Technical Library | 1999-08-27 09:27:10.0
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.
Technical Library | 2019-08-19 09:46:13.0
Boundary scan is a method for testing interconnects on printed circuit boards (PCBs) or sub-blocks inside an integrated circuit. It has rapidly become the technology of choice for building reliable high technology electronic products with a high degree of testability. Due to the low-cost and integrated circuit (IC) level access capabilities of boundary scan, its use has expanded beyond traditional board test applications into product design and service.
Technical Library | 2020-02-03 17:37:36.0
Accurate impact testing is a key component to establishing that a product is not only reliable, but durable in an end-use environment. ACI Technologies tested a high-g circuit board to demonstrate component durability and ruggedization for guided munitions. The Lansmont Model 23 Shock Test System customized with a Dual Mass Shock Amplifier was used for this testing (Figure 1).
Technical Library | 2019-06-18 10:18:00.0
ACI Technologies is tasked with decapsulation of electronics components for testing and investigative purposes. In the normal method of decapsulation, an analyst will drill a small indentation, with a rotary tool, in the hermetic sealant material and then apply Nitric acid to eat through the polymeric encapsulant.
Technical Library | 2020-04-01 14:24:56.0
It happens much too often; manufacturing engineers are brought into a NEW product design phase at the very end of a design and are asked to provide input that should have been provided much earlier. One needs to understand how the circuit board design and quality of the manufacturing process not only effects assembly yield and product reliability, but how it could also affect the results of any testing that is done to circuit packs during prototyping. It is important that any circuit pack (including prototypes) that will be used in reliability, performance and functional testing be designed with the proper features and assembled with a manufacturing process that has been developed to produce a high-quality assembly. If not, the results of any testing might not represent the actual characteristics of the design and provide miss-guidance to future changes.
Technical Library | 2020-12-07 15:26:06.0
Temperature cycling testing is a method of accelerated life testing done to PCCs that are exposed to normal operation temperature variations over its lifetime. During the testing, intermittent "open" failures can first occur at the hot and cold extremes of the test, exposing weaknesses in the design and assembly. A poor/weak solder joint fatigues, a via trace or barrel cracks, loose connections or a component fails all causing an intermittent open. When not at extreme temperatures, the PCC assembly relaxes, the "open" closes creating electrical connectivity. If you are monitoring the PCC under test in-situ you will know that an intermittent failure has occurred, and the test could be stopped for inspection. If in-situ monitoring was not implemented, you would not know if there were intermittent failures or not. The PCC gets powered up and works fine at room temperature.
.png)
Lewis and Clark is your #1 Pre-Owned Surface Mount and In-Circuit Test equipment supplier. We offer a variety of equipment solutions at a significant cost savings over new.
Manufacturer / Equipment Dealer / Broker / Auctions
18 Celina Ave., Unit 16
Nashua, NH USA
Phone: (603) 594-4229
