Technical Library | 2013-02-14 12:54:29.0
Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults, such as solder shorts and opens. Today's advanced IC technology now includes high-speed differential interfaces that include AC or DC coupling components loaded on the printed circuit assembly. Simple stuck-at-high/low test methods are not sufficient to detect all assembly fault conditions, which includes shorts, opens and missing components. Improved diagnostics requires detailed circuit analysis, predictive assembly fault simulation and more complex testing to isolate and accurately detect all possible assembly faults... First published in the 2012 IPC APEX EXPO technical conference proceedings
Technical Library | 2012-06-27 18:26:34.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high speed channel performance. Determining and controlling PCB inser
Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 2021-02-25 14:19:00.0
This study proposes a new design of lightweight and cost-e#14;cient composite materials for the aeronautic industry utilizing recycled fresh scrap rubber, epoxy resin, and graphene nanoplatelets (GnPs). After manufacturing the composites, their bending strength and fracture characteristics were investigated by three-point bending (3PB) tests. Halpin–Tsai homogenization adapted to composites containing GnPs was used to estimate the moduli of the composites, and satisfactory agreement with the 3PB test results was observed.
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
Technical Library | 1999-07-20 11:00:12.0
It's quite common for a power supply (PSU) designer to work with a circuit designer to realize a system design compliant with international EMC regulations. PSU designers will be well aware of the requirement of the power supply to provide clean DC voltage and not disturb the AC mains voltage. However, they may not have any idea of the noise that can potentially be introduced to the mains through the PSU by the target circuit. Likewise, the circuit designers (digital or analogue) may not know what attenuation the PSU will provide.
Technical Library | 2017-04-06 16:50:56.0
Silicon photonics is an IC technology where data is transferred using light that is routed on the chip using optical waveguides (Figure 1). Silicon photonics is best known as a method to solve problems with high input/output bandwidth applications. For example, because of ever-growing bandwidth requirements in datacenters, the optical transmit and receive heads are being placed closer and closer to the board and the IC. But, designers also apply this technology to biosensors, medical diagnostics, and environmental monitoring. Regardless of the application, photonic ICs always need integration to electronic circuits and this results in unique challenges.
Technical Library | 2023-10-23 18:56:52.0
A thin chip package for off-the-shelf ICs is developed which enables the embedding of these chips into a flexible circuit board. The package consists of a copper fan-out on a polyimide substrate, in which the thinned IC (30um) is embedded. These packages are subsequently integrated in a standard flexible circuit board (FCB). A microcontroller and a proprietary DSP processor are embedded using this technology. The yield of the Ultra-Thin Chip package (UTCP) was measured before embedding in the circuit board, and reaches up to 87% for the packaged microcontrollers (MSP430 family, known-good dies). The yield on the DSP processor was measured to be 62%. After embedding in the FCB, 95% of the functional UTCP-packaged dies are still functional.
Technical Library | 2013-01-03 20:27:54.0
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.
Technical Library | 2019-02-25 05:24:53.0
"The idea of the value chain is based on the process view of organizations, the idea of seeing a manufacturing (or service) organization as a system, made up of subsystems each with inputs, transformation processes and outputs".[1] The definition of a value-added chain by Michael E. Porter is one of many to be found in reference books, works and on websites. In principle, it involves a sequence of activities, executed by a manufacturing company to develop, produce, sell, ship, and maintain products or services. Three main parameters essentially influence a value-added chain: Direct activities − research, development, production, shipment etc. Indirect activities − maintenance, operation, occupational safety, environment etc. Quality assurance − monitoring, test/inspection; quality management etc. In particular, indirect activities and quality assurance generate a greater part of the costs in product manufacturing. This article principally focusses on the indirect activities, among them air purification.
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