Technical Library: inerted (Page 1 of 1)

BENEFITS OF INERT GAS SOLDERING FOR PRINTED CIRCUIT BOARD ASSEMBLY PROCESSES

Technical Library | 2023-12-18 20:41:20.0

This review of inert atmosphere for the electronics assembly processes will look at the benefits and attempt to close the gap on some of the misconceptions of using inert gases for electronics assembly. We will look at the reasons for using nitrogen and the cost benefits that come with the use of this inert atmosphere gas. As part of this review we will be explain the needs assessment and when you should use an inert atmosphere for your assembly process. Case studies will be provided to demonstrate the benefits of an inert atmosphere in the electronics assembly process area.

Air Products

Optimizing the Wave Soldering Process with Hot Nitrogen Knives

Technical Library | 1999-04-29 15:39:03.0

The paper describes the effects of a debridging knife on inerted soldering environments in an Electrovert Econopak wave solder machine. It reviews experiments to improve the purity of the soldering environment and results of the tests.

Siemens Process Industries and Drives

Hermetically Sealed SMD Tantalum Capacitors

Technical Library | 2011-12-15 17:21:42.0

manganese dioxide or conductive polymer cathode. Higher stability is achieved by placement of the capacitor into an SMD case filled by an inert atmosphere and hermetically sealed. The long term stability testing performed on such hermetically sealed capac

AVX Corporation

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

Technical Library | 2017-02-09 17:08:44.0

The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.

Indium Corporation

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