1 ipc standard acceptance criteria solder balls[0] result

Using Rheology Measurement As A Potentially Predictive Tool For Solder Paste Transfer Efficiency And Print Volume Consistency

Technical Library | 2020-07-02 13:29:37.0

Industry standards such as J-STD-005 and JIS Z 3284-1994 call for the use of viscosity measurement(s) as a quality assurance test method for solder paste. Almost all solder paste produced and sold use a viscosity range at a single shear rate as part of the pass-fail criteria for shipment and customer acceptance respectively. As had been reported many times, an estimated 80% of the defects associated with the surface mount technology process involve defects created during the printing process. Viscosity at a single shear rate could predict a fatal flaw in the printability of a solder paste sample. However, false positive single shear rate viscosity readings are not unknown.

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