Technical Library: j-std-001 damage to solder pad ling (Page 1 of 1)

How to choose printing squeegees and Pressure details affect printing solder paste result

Technical Library | 2022-07-11 09:24:48.0

The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.

Shenzhen FS equipment CO.,LTD

  1  

j-std-001 damage to solder pad ling searches for Companies, Equipment, Machines, Suppliers & Information

Sell Used SMT & Test Equipment

High Precision Fluid Dispensers
December 2024 Auction

Best Reflow Oven
Software for SMT

World's Best Reflow Oven Customizable for Unique Applications


We offer SMT Nozzles, feeders and spare parts globally. Find out more
PCB separator

Internet marketing services for manufacturing companies