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1 j-std-001 damage to solder pad ling result

Technical Library: j-std-001 damage to solder pad ling (Page 1 of 1)

How to choose printing squeegees and Pressure details affect printing solder paste result

Technical Library | 2022-07-11 09:24:48.0

The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.

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