Technical Library: j-std-001 damage to solder pad ling (Page 1 of 1)

How to choose printing squeegees and Pressure details affect printing solder paste result

Technical Library | 2022-07-11 09:24:48.0

The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.

Shenzhen FS equipment CO.,LTD

  1  

j-std-001 damage to solder pad ling searches for Companies, Equipment, Machines, Suppliers & Information

Fluid Dispensing, Staking, TIM, Solder Paste

Training online, at your facility, or at one of our worldwide training centers"
best pcb reflow oven

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
High Throughput Reflow Oven

Component Placement 101 Training Course
Win Source Online Electronic parts

Software for SMT placement & AOI - Free Download.
Hot selling SMT spare parts and professional SMT machine solutions

Private label coffee for your company - your logo & message on each bag!