Technical Library: j-std-001 damage to solder pad ling (Page 1 of 1)

How to choose printing squeegees and Pressure details affect printing solder paste result

Technical Library | 2022-07-11 09:24:48.0

The change of squeegee pressure has a significant impact on printing. Too small pressure will make the solder paste unable to effectively reach the bottom of the stencil opening and not be well deposited on the pad. Too much pressure will cause tin The paste is printed too thin and can even damage the stencil.

Shenzhen FS equipment CO.,LTD

  1  

j-std-001 damage to solder pad ling searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

Component Placement 101 Training Course
Solder Paste Dispensing

Reflow Soldering 101 Training Course
PCB Handling Machine with CE

Software for SMT placement & AOI - Free Download.
IPC Training & Certification - Blackfox

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Hot selling SMT spare parts and professional SMT machine solutions

Low-cost, self-paced, online training on electronics manufacturing fundamentals