Technical Library: john (Page 1 of 7)

Repeatability of the Temperature Profile under Load Variation

Technical Library | 2023-01-17 17:49:30.0

Repeatability of the Temperature Profile under Load Variation

Heller Industries Inc.

THE LAST WILL AND TESTAMENT OF THE BGA VOID

Technical Library | 2023-01-17 17:22:28.0

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

Heller Industries Inc.

Considerations in Dispensing Conformal Coatings

Technical Library | 1999-08-27 09:27:10.0

Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.

ASYMTEK Products | Nordson Electronics Solutions

On Oreology, the fracture and flow of "milk's favorite cookie® "

Technical Library | 2024-08-29 18:30:46.0

The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study

1st Place Machinery Inc.

How to Profile a PCB

Technical Library | 2009-04-22 21:13:19.0

An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.

DDM Novastar Inc

Auger Valve Dispensing

Technical Library | 2007-01-31 14:10:17.0

This white paper is suitable for both new and experienced users. It is a practical education in the use and misuse of auger valves for solder paste dispensing.

Nordson EFD

Reflow Profiling Guide

Technical Library | 2007-01-31 14:14:56.0

This paper explains the solder paste reflow process and the best practices to follow when developing your profile.

Nordson EFD

Five Myths of Reliability

Technical Library | 2008-12-23 22:32:32.0

Myth 1: I don't worry about design, because most of my problems are with defects from suppliers...

DfR Solutions (acquired by ANSYS Inc)

New Developments in PCB Laminates

Technical Library | 2012-07-19 21:24:02.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high

Rogers Corporation

PCB/Substrate Finishing Overview

Technical Library | 2023-01-06 16:18:23.0

PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG.

MacDermid, Inc.

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