Technical Library: juki and driver (Page 1 of 1)

JUKI PCB SMT Pick and Place Machines: The Gold Standard

Technical Library | 2023-09-16 07:16:54.0

JUKI is a leading manufacturer of SMT pick and place machines, and their products are known for their high quality, precision, and reliability. In this article, we will discuss the benefits of using JUKI PCB SMT pick and place machines, including: High accuracy and precision Fast production speeds Flexible capabilities Reliable performance

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Organic Flip Chip Packages for Use in Military and Aerospace Applications

Technical Library | 2006-11-14 12:48:31.0

Content: 1. Bridge from Commercial Reliability 2. Existing PBGA use in Aerospace & Military 3. Drivers: Plastic versus Ceramic Package Weight 4. Attributes of PTFE and Thin Core FC Packages 5. Flip Chip Package Reliability 6. Flip Chip Package

i3 Electronics

SMT Placement for ICs, Connectors and Odd-Shaped Components

Technical Library | 2009-11-18 23:37:52.0

Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link.

Juki Automation Systems

Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test

Technical Library | 2016-02-04 19:11:47.0

In a typical mechatronic manufacturing functional test setup, actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels, these can usually be managed with general purpose switches. However, when it comes to higher power levels of currents more than 5 amps, such switching and loading might pose a greater challenge. Furthermore, critically in the manufacturing line, the tradeoff between cost and test time would have a great influence on the test strategy.This paper will present some key points to design a cost effective high power switching and load management solution.

Keysight Technologies

The Effect of Coating and Potting on the Reliability of QFN Devices.

Technical Library | 2014-08-28 17:09:23.0

The fastest growing package types in the electronics industry today are Bottom Termination Components (BTCs). While the advantages of BTCs are well documented, they pose significant reliability challenges to users. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies. This is especially true for new component packaging like BTCs. Obtaining relevant information can be difficult since information is often segmented and the focus is on design opportunities not on reliability risks (...)Commonly used conformal coating and potting processes have resulted in shortened fatigue life under thermal cycling conditions. Why do conformal coating and potting reduce fatigue life? This paper details work undertaken to understand the mechanisms underlying this reduction. Verification and determination of mechanical properties of some common materials are performed and highlighted. Recommendations for material selection and housing design are also given.

DfR Solutions

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