Technical Library | 2023-03-16 18:57:32.0
Outline * Introduction & Background * Factors Affecting CAF Formation * CAF Formation ** Catastrophic Field Failure of Military Hardware ** Laboratory Experiments * Conclusion
Technical Library | 2010-01-06 22:27:03.0
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.
Technical Library | 2019-12-18 23:28:07.0
Electronic tongue systems equipped with cross-sensitive potentiometric sensors have been applied to pharmaceutical analysis, due to the possibility of various applications and developing new formulations. Many studies already proved the complementarity between the electronic tongue and classical analysis such as dissolution tests indicated by Pharmacopeias. However, as a new approach to study pharmaceuticals, electronic tongues lack strict testing protocols and specification limits; therefore, their results can be improperly interpreted and inconsistent with the reference studies. Therefore, all aspects of the development, measurement conditions, data analysis, and interpretation of electronic tongue results were discussed in this overview. The critical evaluation of the effectiveness and reliability of constructed devices may be helpful for a better understanding of electronic tongue systems development and for providing strict testing protocols.
Technical Library | 2015-04-02 20:12:58.0
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. According to the iNEMI 2013 placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 um by 2023.This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape. The correlation of deposit diameter and positioning deviation as a function of piezo actuation profile shows that positioning error for deposits increase almost monotonically with decreasing droplet volume irrespective of the piezo-actuation profile. The trends for shape and satellite levels are not as clear and demand further study.
Technical Library | 2020-03-04 23:53:17.0
Critical to maintaining quality control in high-throughput screening is the need for constant monitoring of liquid-dispensing fidelity. Traditional methods involve operator intervention with gravimetric analysis to monitor the gross accuracy of full plate dispenses, visual verification of contents, or dedicated weigh stations on screening platforms that introduce potential bottlenecks and increase the plate-processing cycle time. We present a unique solution using open-source hardware, software, and 3D printing to automate dispenser accuracy determination by providing real-time dispense weight measurements via a network-connected precision balance. This system uses an Arduino microcontroller to connect a precision balance to a local network. By integrating the precision balance as an Internet of Things (IoT) device, it gains the ability to provide real-time gravimetric summaries of dispensing, generate timely alerts when problems are detected, and capture historical dispensing data for future analysis. All collected data can then be accessed via a web interface for reviewing alerts and dispensing information in real time or remotely for timely intervention of dispense errors. The development of this system also leveraged 3D printing to rapidly prototype sensor brackets, mounting solutions, and component enclosures.
Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
Technical Library | 2010-03-18 14:02:03.0
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.
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