Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-12-01 11:08:12.0
Choosing the Right Model I.C.T SMT Coating Machine In the realm of SMT Coating Machine, I.C.T offers an extensive array of advanced models tailored to diverse production needs. The choice of the right machine significantly influences the efficiency and precision of your conformal coating process. This article will provide an in-depth exploration of I.C.T's PCB conformal coating spray machine models, specifically the I.C.T-T550, I.C.T-T550U, I.C.T-T600, and I.C.T-T650, assisting you in making an informed decision aligned with your specific requirements. I.C.T PCB Conformal Coating Spray Machines Overview I.C.T, renowned for its commitment to innovation, quality, and safety, ensures all models hold CE certification. Let's delve into the key distinctions between these models and the essential factors to consider when selecting the ideal machine for your needs. I.C.T-T550: Precision in Simplicity The I.C.T-T550 SMT Coating Machine model features two critical valves: the atomization valve and the precision valve. If you're interested in exploring a variety of coating valves, simply click here for more information. Ideal for applications where fixed valves suffice, the I.C.T-T550, lacking rotation or tilting capabilities, ensures consistent and reliable results for straightforward conformal coating requirements. I.C.T-T550U: Unleash Flexibility For those requiring more versatility, the I.C.T-T550U SMT Coating Machine model is designed to meet your needs. The addition of a rotating U-axis empowers the valves to rotate a full 360 degrees and tilt up to 35 degrees, enabling precise coating in challenging, intricate areas. The I.C.T-T550U's flexibility makes it an excellent choice for a wide range of applications. I.C.T-T600: Doubling Efficiency Closely resembling the I.C.T-T550 SMT Coating Machine, the I.C.T-T600 boasts a unique feature – equipped with two atomization valves. This dual-valve setup enables simultaneous coating of two PCBs, effectively doubling production efficiency. Ideal for applications prioritizing speed and efficiency, the I.C.T-T600 SMT Coating Machine streamlines the coating process. I.C.T-T650: Versatility Redefined In cases requiring different valves for comprehensive coating, the I.C.T-T650 SMT Coating Machine is the solution. This model features two atomization valves and two precision valves, offering exceptional flexibility for diverse conformal coating applications. The I.C.T-T650 SMT Coating Machine ensures precise and reliable results for even the most complex coating needs. Conclusion: PCB Conformal Coating Spray Machines Selecting the right I.C.T PCB conformal coating spray machine is crucial for enhancing the efficiency and effectiveness of your production process. Consider factors such as the size, complexity, and coating requirements of your PCBAs. Rest assured, I.C.T's unwavering commitment to innovation, quality, and safety guarantees the perfect solution to elevate your conformal coating endeavors. If you need further guidance or wish to tap into the expertise of I.C.T professional engineers for designing a customized coating production line, do not hesitate to reach out. We are here to help you achieve optimal results while meeting European safety standards. If uncertain about whether your product requires a PCB dispensing machine or coating machine, feel free to reach out directly or click here to read our comprehensive guide for further insights: Differences Between Coating & Dispensing.
Technical Library | 2007-02-01 09:57:15.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture.
Technical Library | 2007-02-01 10:08:40.0
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.
Technical Library | 2007-06-21 17:03:16.0
The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs.
Technical Library | 2010-07-15 19:19:56.0
When reworking more complex SMT components such as finer pitch SMT components, SMTconnectors and even area array devices, the most common method of printing on the printing selectively on the PCB has some serious shortcomings. The most significant problem
Technical Library | 2022-10-31 18:35:40.0
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages they offer, the use of Ball Grid Array packages is common across all industry sectors. They are also prone to process voiding issues. This study was performed to determine if vacuum assisted reflow process can help alleviate the voids in area array solder joints. Test parameters in this study largely focused on vacuum pressure level and vacuum dwell time.
Technical Library | 2019-07-30 15:29:50.0
Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50°/75°C, -55°/100°C, and -55°/125°C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies.
Technical Library | 2021-12-21 23:01:30.0
High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high reliability versions with 1.27 mm pitch are now being considered for use in a number of NASA systems including the Space Shuttle and Mars Rovers. NASA functional system designs are requiring ever more denser AAP packages and board features, making board microvia technology very attractive for effectively routing a large number of package inputs/outputs.
Technical Library | 2011-12-29 17:33:21.0
2011 IPC APEX EXPO Conference Article: Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package miniaturization and densi
