Technical Library | 2023-08-16 18:48:50.0
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2023-11-14 02:36:41.0
Understanding In-Circuit Testing (ICT) with PCBA ICT Testing Machine In-Circuit Testing, commonly known as ICT, stands as a sophisticated and precise method within electronics manufacturing. It serves to evaluate the functionality and integrity of individual electronic components on a Printed Circuit Board (PCB). The process employs specialized equipment called ICT Testers, meticulously designed to pinpoint defects, shorts, opens, and other potential issues within the PCB assembly. The Crucial Role of PCBA ICT Testing Machine 1. Quality Assurance ICT is pivotal in ensuring the overall quality and reliability of electronic products. Early identification and rectification of defects in the production process help manufacturers avoid costly recalls, rework, and post-production issues. 2. Cost-Efficiency ICT significantly reduces manufacturing costs by identifying defects at an early stage. This results in fewer defective units reaching the end of the production line, minimizing waste and rework. 3. Faster Time-to-Market Manufacturers can expedite the production process with ICT by swiftly identifying and resolving issues. This leads to faster product launches, providing a competitive edge in the market. Unveiling the Functions of PCBA ICT Testing Machine The ICT Tester, the core of the In-Circuit Testing process, conducts a battery of tests on each PCB, including: 1. Continuity Testing Checks for open circuits, ensuring all connections are properly established. 2. Component Verification Verifies the presence and orientation of components, ensuring alignment with the PCB design. 3. Functional Testing Some ICT Testers execute functional tests, assessing electronic components' performance as per specifications. 4. Short Testing Identifies unintended connections or shorts between different components on the PCB. 5. Insulation Testing Checks for isolation between different circuits, ensuring no undesired connections or paths. 6. Programming and Configuration In some cases, ICT Testers are used to program and configure specific components on the PCB. Advantages of PCBA ICT Testing Machine 1. High Precision ICT offers unparalleled accuracy in defect detection, making it crucial in modern electronics manufacturing. 2. Speed and Efficiency ICT Testers enable rapid testing, allowing manufacturers to assess a large number of PCBs in a short time. 3. Customization ICT Tests can be tailored to suit specific PCB requirements, ensuring thorough evaluation of every design aspect. 4. Data Collection ICT Testers gather valuable data for process optimization and quality control. In-Circuit Testing (ICT) is fundamental in electronics manufacturing, safeguarding product quality, reducing costs, and accelerating time-to-market. The ICT Tester, with its precision and efficiency, positions manufacturers at the forefront of the highly competitive electronics industry. Embracing ICT is not just a choice; it's a necessity for manufacturers striving for excellence in their products. I.C.T is a leading manufacturer of full SMT line machines in the electronic manufacturing industry. Discover how we can enhance product quality, boost performance, and reduce costs. Contact us at info@smt11.com for reliable global supply, unparalleled efficiency, and superior technical service.
Technical Library | 2024-04-29 21:39:52.0
In this paper, we develop and put into practice an Automatic Optical Inspection (AOI) system based on machine vision to check the holes on a printed circuit board (PCB). We incorporate the hardware and software. For the hardware part, we combine a PC, the three-axis positioning system, a lighting device and CCD cameras. For the software part, we utilize image registration, image segmentation, drill numbering, drill contrast, and defect displays to achieve this system. Results indicated that an accuracy of 5µm could be achieved in errors of the PCB holes allowing comparisons to be made. This is significant in inspecting the missing, the multi-hole and the incorrect location of the holes. However, previous work only focusses on one or other feature of the holes. Our research is able to assess multiple features: missing holes, incorrectly located holes and excessive holes. Equally, our results could be displayed as a bar chart and target plot. This has not been achieved before. These displays help users analyze the causes of errors and immediately correct the problems. Additionally, this AOI system is valuable for checking a large number of holes and finding out the defective ones on a PCB. Meanwhile, we apply a 0.1mm image resolution which is better than others used in industry. We set a detecting standard based on 2mm diameter of circles to diagnose the quality of the holes within 10 seconds.
Technical Library | 2009-08-26 19:32:32.0
Automated optical inspection (AOI) and automated X-ray inspection (AXI) have been around for some time in various configurations and both have played a role in improving the quality of circuit boards. While some companies opt for one technology over the other, each form of inspection contributes its own unique benefit to the manufacturing process.
Technical Library | 2019-05-22 21:24:05.0
voidless treatment Smaller components -> miniaturization (01005 capability) Large board handling -> dynamic preheating for large board repair Repeatable processes -> flux and paste application (Dip and Print), residual solder removal (scavenging), dispensing, multiple component handling, and traceability Operator support -> higher automation, software guidance
Technical Library | 2009-07-15 12:14:31.0
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005.
Technical Library | 2007-04-05 13:48:50.0
Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints.
Technical Library | 2013-08-07 21:52:15.0
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen...
Technical Library | 2011-07-28 18:52:34.0
Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel (clearance to the next card above the components) and large protrusions (components, e.g., BGAs, PQF
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