Technical Library | 2023-07-22 02:26:05.0
Patch offset; Uneven patches throughout the substrate (each substrate is offset in a different way); Only part of the substrate is offset; Only certain components are offset; The patch Angle is offset; Component absorption error; Laser identification (component identification) error; Nozzle loading and unloading error; Mark (BOC mark, IC mark) identification error; Image recognition error (KE-2060 only); Analysis of the main reasons for throwing material. More information about KINGSUN please Contact US at jenny@ksunsmt.com or visit www.ksunsmt.com
Technical Library | 2024-06-10 17:27:24.0
A description of CNC laser cutting.
Technical Library | 2024-09-04 17:19:30.0
Reviews Kapton material and how it is laser cut and applications supported.
Technical Library | 2024-07-30 17:02:42.0
Reviews the methods of waterjet and laser cutting of PEEK materials.
Technical Library | 2024-08-05 16:57:08.0
A review of the factors involved in calculating the the cost of laser cutting and how laser cutting time is also calculated.
Technical Library | 2024-08-06 14:39:04.0
An article describing the process of laser cutting molybdenum with tips and benefits.
Technical Library | 2024-09-19 15:55:23.0
What steps are taken to ensure ESD safety for laser depanel process.
Technical Library | 2024-09-24 19:32:01.0
Reviews the laser technology used to cut brass and hurdles that need tp be overcome.
Technical Library | 2024-06-26 16:57:17.0
How UV lasers cut Kapton and where you can find more information about it.
Technical Library | 2011-12-08 17:46:42.0
The past few years have brought PCB assemblers a multitude of choices for SMT stencil materials and coatings. In addition to the traditional laser-cut stainless steel (SS) or electroformed nickel, choices now include SS that has been optimized for laser c
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