Technical Library | 2014-01-30 18:08:04.0
As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...
Technical Library | 2008-01-03 17:50:51.0
Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.
Technical Library | 2011-06-09 20:28:30.0
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and
Technical Library | 2012-03-22 20:40:01.0
Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ha
Technical Library | 2009-06-11 19:27:21.0
The shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders.
Technical Library | 2010-03-30 21:51:23.0
This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale packages (CSPs) on a standard JEDEC drop reliability test board.
Technical Library | 2010-11-04 19:56:25.0
Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab
Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 2010-06-10 21:01:48.0
This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies.
Technical Library | 2013-01-05 22:21:01.0
More and more countries legislate to forbib lead usage in solder material. However, the lead-free solder wire has higher melting point and soldering temperature, increase soldering iron temperature may damage the PCB or components. How to solve this problem?
