1 lpkf stencil inspection equipment result

Optimization of Stencil Apertures to Compensate for Scooping During Printing

Technical Library | 2018-03-07 22:41:05.0

This study investigates the scooping effect during solder paste printing as a function of aperture width, aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. A typical bimodal percent volume distribution is attributed to poor release apertures and large apertures, where scooping takes place, yielding percent volumes 100%. This printing experiment is done with a concomitant validation of the printing process using standard 3D Solder Paste Inspection (SPI) equipment.

Qual-Pro Corporation