Technical Library | 2023-08-16 18:48:50.0
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"
Technical Library | 1999-08-05 09:31:04.0
This document provides suggested standard contents for equipment reference manuals for semiconductor process equipment. It includes a generic and detailed outline for equipment manuals, with major sections on installing, operating, controlling, and integrating process equipment.
Technical Library | 1999-05-06 14:39:20.0
ntelís traditional microprocessor test methodology, based on manually generated functional tests that are applied at speed using functional testers, is facing serious challenges due to the rising cost of manual test generation and the increasing cost of high-speed testers. If current trends continue, the cost of testing a device could exceed the cost of manufacturing it. We therefore need to rely more on automatic test pattern generation (ATPG) and low-cost structural testers.
Technical Library | 1999-05-06 14:19:44.0
In many high-performance VLSI designs, including all recent Intel microprocessors, datapath is implemented in a bit-sliced structure to simultaneously manipulate multiple bits of data. The circuit and layout of such structures are largely kept the same for each bit slice to achieve maximal performance, higher designer productivity, and better layout density. There are very few tools available to automate the design of a general datapath structure, most of which is done manually...
Technical Library | 2023-11-20 17:42:33.0
Zero-defect strategies and increased demands on the production of assemblies are making quality assurance in electronics production increasingly important. Continous miniaturization of components, ever higher packing densities and the associated hard-to-view assembly areas, as well as the increased use of components such as BGAs, QFNs and QFPs, pose a considerable challenge when it comes to high-precision quality control.
Technical Library | 2017-11-10 00:58:37.0
Modern electronics manufacturing is made up by a multiplicity of different separation and joining processes, with the later surely taking the vast majority of production technology. Alongside gluing, welding and laser processes, soldering still holds a primary position in electronic assemblies. However, soldering does not always equal soldering, because there are quite a lot of different soldering technologies. Accordingly, you have to distinguish between automated and manual soldering procedures. No matter which soldering process you analyse, all of them have one aspect in common: they produce airborne pollutants, which may have a negative impact on employees, plants and products as well.
Technical Library | 2018-06-20 13:11:57.0
Manufacturers test to ensure that the product is built correctly. Shorts, opens, wrong or incorrectly inserted components, even catastrophically faulty components need to be flagged, found and repaired. When all such faults are removed, however, functional faults may still exist at normal operating speed, or even at lower speeds. Functional board test (FBT) is still required, a process that still relies on test engineers’ understanding of circuit functionality and manually developed test procedures. While functional automatic test equipment (ATE) has been reduced considerably in price, FBT test costs have not been arrested. In fact, FBT is a huge undertaking that can take several weeks or months of test engineering development, unacceptably stretching time to market. The alternative, of selling products that have not undergone comprehensive FBT is equally, if not more, intolerable.
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