Technical Library | 2023-07-21 07:49:08.0
I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.
Technical Library | 2023-09-16 07:08:30.0
Elevate your LED production with our cutting-edge LED high-speed pick and place machine. Experience unmatched precision and efficiency to meet your manufacturing needs.
Technical Library | 2023-09-16 07:16:54.0
JUKI is a leading manufacturer of SMT pick and place machines, and their products are known for their high quality, precision, and reliability. In this article, we will discuss the benefits of using JUKI PCB SMT pick and place machines, including: High accuracy and precision Fast production speeds Flexible capabilities Reliable performance
Technical Library | 2023-09-16 07:15:41.0
SMT LED pick and place machines are essential for manufacturers of LED products. These machines can place LEDs quickly and accurately, making them ideal for mass production.
Technical Library | 2023-09-16 07:12:35.0
Elevate your LED strip manufacturing with our top-notch pick and place machine. Enhance precision and productivity for superior results in every assembly.
Technical Library | 2023-09-18 03:53:42.0
好的，以下是根据标题"LED Lens Production Line Solution"写的SEO元描述和标题： SEO Meta Description (300 characters) LED Lens Production Line Solutions: The Complete Package for Efficient and Reliable LED Lens Manufacturing Our LED lens production line solutions are the perfect way to improve your LED lens manufacturing efficiency and reliability. Our solutions include all the equipment and services you need to produce high-quality LED lenses, from lens molding to assembly.
Technical Library | 2022-08-02 17:35:18.0
Saving resources in electronics manufacturing is not an end in itself. It is closely linked with reducing costs and gaining a competitive advantage. However, innovative adhesion and potting technologies in combination with highly functional adhesives and potting media make a significant contribution to the ideal union between economic performance and a reduced ecological footprint.
Technical Library | 2010-08-26 21:06:17.0
Driven by high-profile regulations compliance like the TREAD Act, warranty management has become a hot topic across industries worldwide. Recalls are costly and time-consuming events that should be avoided entirely. But without adequate process traceability and product genealogy, too many customers will get defective products and too many products will be recalled for repair or replacement even though they are not defective. Both scenarios have enormous implications for the quality-conscious manufacturer that gets rated on the number of recalls it performs - not to mention the enormous direct costs. The core issue is visibility into product quality.
Technical Library | 2017-11-10 00:58:37.0
Modern electronics manufacturing is made up by a multiplicity of different separation and joining processes, with the later surely taking the vast majority of production technology. Alongside gluing, welding and laser processes, soldering still holds a primary position in electronic assemblies. However, soldering does not always equal soldering, because there are quite a lot of different soldering technologies. Accordingly, you have to distinguish between automated and manual soldering procedures. No matter which soldering process you analyse, all of them have one aspect in common: they produce airborne pollutants, which may have a negative impact on employees, plants and products as well.
Technical Library | 2013-01-24 19:16:35.0
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.
