Technical Library | 2023-09-16 07:15:41.0
SMT LED pick and place machines are essential for manufacturers of LED products. These machines can place LEDs quickly and accurately, making them ideal for mass production.
Technical Library | 2023-09-16 04:04:13.0
Online axial insertion machines are a fast and efficient way to insert components into PCBs. They are ideal for mass production applications where accuracy and repeatability are essential.
Technical Library | 2008-10-01 14:02:27.0
This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.
Technical Library | 2023-09-16 03:40:41.0
Wave soldering machines are the most efficient way to solder PCBs. They are used to solder components to a PCB by passing the PCB through a wave of molten solder. This process is fast, accurate, and repeatable, making it ideal for mass production. In this article, we will discuss the basics of wave soldering machines, including their components, operation, and benefits. We will also provide a buying guide to help you choose the right wave soldering machine for your needs.
Technical Library | 2011-07-07 03:37:13.0
The demand for miniaturized electronic equipment and fully-automated assembly lines for mass-production of new products require the availability of a complete range of SMD components
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2023-11-14 19:52:11.0
The continuous drive in the Electronics industry to build new and innovative products has caused competitive design companies to develop assemblies with consolidated PCB designs, decreased physical sizes, and increased performance characteristics. As a result of these new designs, manufacturers of electronics are forced to contend with many challenges. One of the most significant challenges being the processing of thru-hole components on high thermal mass PCBs having the potential to exceed 20 layers in thicknesses and have copper mass contents of over 40oz. High thermal mass PCBs, coupled with the use of mixed technologies, decreased component spacing, and the change from Tin Lead Solder to Lead Free Alloys has lead many manufacturing facilities to purchase advanced soldering equipment to process challenging assemblies with a high degree of repeatability.
Technical Library | 2021-10-27 02:20:31.0
The mass flow sensor, or air flow sensor is one of the important sensors of the electronic fuel injection engine. It is installed between the air filter and the intake hose to measure the intake volume of the engine cylinder and adjust the fuel ratio according to it. The mass flow sensor converts the inhaled air flow into electrical signals and sends them to the electronic control unit (ECU). As one of the basic signals to determine the fuel injection, it is a sensor that measures the air flow of the suction engine. So if you want to test it, how should you do? Let's start it.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Technical Library | 2010-09-23 20:23:37.0
Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over the world at this time. The material composition and temperature properties of PCB are necessary to be known for an optimal recycling technology. For thi
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