Technical Library | 2023-11-14 02:36:41.0
Understanding In-Circuit Testing (ICT) with PCBA ICT Testing Machine In-Circuit Testing, commonly known as ICT, stands as a sophisticated and precise method within electronics manufacturing. It serves to evaluate the functionality and integrity of individual electronic components on a Printed Circuit Board (PCB). The process employs specialized equipment called ICT Testers, meticulously designed to pinpoint defects, shorts, opens, and other potential issues within the PCB assembly. The Crucial Role of PCBA ICT Testing Machine 1. Quality Assurance ICT is pivotal in ensuring the overall quality and reliability of electronic products. Early identification and rectification of defects in the production process help manufacturers avoid costly recalls, rework, and post-production issues. 2. Cost-Efficiency ICT significantly reduces manufacturing costs by identifying defects at an early stage. This results in fewer defective units reaching the end of the production line, minimizing waste and rework. 3. Faster Time-to-Market Manufacturers can expedite the production process with ICT by swiftly identifying and resolving issues. This leads to faster product launches, providing a competitive edge in the market. Unveiling the Functions of PCBA ICT Testing Machine The ICT Tester, the core of the In-Circuit Testing process, conducts a battery of tests on each PCB, including: 1. Continuity Testing Checks for open circuits, ensuring all connections are properly established. 2. Component Verification Verifies the presence and orientation of components, ensuring alignment with the PCB design. 3. Functional Testing Some ICT Testers execute functional tests, assessing electronic components' performance as per specifications. 4. Short Testing Identifies unintended connections or shorts between different components on the PCB. 5. Insulation Testing Checks for isolation between different circuits, ensuring no undesired connections or paths. 6. Programming and Configuration In some cases, ICT Testers are used to program and configure specific components on the PCB. Advantages of PCBA ICT Testing Machine 1. High Precision ICT offers unparalleled accuracy in defect detection, making it crucial in modern electronics manufacturing. 2. Speed and Efficiency ICT Testers enable rapid testing, allowing manufacturers to assess a large number of PCBs in a short time. 3. Customization ICT Tests can be tailored to suit specific PCB requirements, ensuring thorough evaluation of every design aspect. 4. Data Collection ICT Testers gather valuable data for process optimization and quality control. In-Circuit Testing (ICT) is fundamental in electronics manufacturing, safeguarding product quality, reducing costs, and accelerating time-to-market. The ICT Tester, with its precision and efficiency, positions manufacturers at the forefront of the highly competitive electronics industry. Embracing ICT is not just a choice; it's a necessity for manufacturers striving for excellence in their products. I.C.T is a leading manufacturer of full SMT line machines in the electronic manufacturing industry. Discover how we can enhance product quality, boost performance, and reduce costs. Contact us at info@smt11.com for reliable global supply, unparalleled efficiency, and superior technical service.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2009-07-22 18:33:41.0
This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate. The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. A numerical model was used to simulate the temperature rise in the TV.
Technical Library | 2019-06-06 00:19:02.0
More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed pressfit connectors that are often used to connect mother boards and back planes in core network nodes. These new high speed pressfit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bentor permanently deformed and if the holes are too large they will not form gas tight connections.The goal of this project was to understand how rework of these new high speed pressfit connectors affects connection strengths, hole wall deformations and plating cracks.
Technical Library | 2010-03-18 14:02:03.0
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.
Technical Library | 2014-11-13 19:23:50.0
With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advances in semiconductor technology, particularly in the regime of high-power components, the temperature dependence of the long-term reliability is a critical parameter and has to be considered with highest possible care during the design phase (...) The aim of this paper is to give a short overview about standard thermal solutions like thick copper, thermal vias, plugged vias or metal core based PCBs. Furthermore, attention will be turned on the development of copper filled thermal vias in thin board constructions...
Technical Library | 2019-01-09 19:19:52.0
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated soldering or rework operations, users may work with Sn-Ag-Cu or Sn-Cu based alloys. One of the challenges with these types of lead-free alloys for automated / hand soldering operations, is that the life of the soldering iron tips will shorten drastically using lead-free solders with an increased cost of soldering iron tool maintenance/ tip replacement. Development was done on a new lead-free low silver solder rework alloy (Sn-0.3Ag-0.7Cu-0.04Co) in comparison with a number of alternative lead-free alloys including Sn-0.3Ag-0.7Cu, Sn-0.7Cu and Sn-3.0Ag-0.5Cu and tin-lead Sn40Pb solder in soldering evaluations.
Technical Library | 2020-06-19 19:08:14.0
The designs of electronic devices and systems are being continuously improved by becoming smaller in size and faster in communication speed. The potential risk associated with these specific design improvements will be an increase in power density and, consequently, a greater risk of thermal problems and failures. At the same time, the prevailing use of circuit boards integrated with power devices such as motor controllers and drivers, light-emitting diode (LED) lighting modules, power supplies, and amplifiers, and regulators for TV, etc., drive to the use of a proper thermal management system while designing these kinds of printed circuit board (PCB).
Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
| 1 |
