Technical Library: metcal bga (Page 1 of 1)

Profiling for Successful BGA/CSP Rework

Technical Library | 2013-08-14 14:06:48.0

This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.

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Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

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