Technical Library: metcal ir rework (Page 1 of 1)

Hot Air vs. IR BGA Rework Stations

Technical Library | 2018-04-27 12:59:29.0

Hot Air and IR are the two main types of rework stations used by OEMs and PCB contract manufacturers today. Both have advantages and disadvantages and choosing the right one for your application requires a careful consideration of a number of factors, including your budget, your working requirements and the capabilities of your staff. In this article, we outline some of the differences between hot air and IR BGA rework stations.

Precision PCB Services, Inc

Profiling for Successful BGA/CSP Rework

Technical Library | 2013-08-14 14:06:48.0

This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.

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Rework Challenges for Smart Phones and Tablets

Technical Library | 2015-04-23 18:48:18.0

Smart phones are complex, costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with more than a 70% greater number of packages now found inside of them than just a few years ago. For instance, 1080P HD camera and video capabilities are now available on most high end smart phones or tablet computers, making their production more elaborate and expensive. The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150.00, with higher end smart phones going up to $238.00, and tablets well over $300.00.

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