Technical Library | 2014-04-24 16:37:42.0
By May 31, 2014, it is expected that companies, officially known as issuers, will be required to take the unprecedented step of submitting their first conflict minerals disclosures to the Securities and Exchange Commission, or SEC. This paper is intended to describe the content that certain sustainable and responsible investors, or SRIs, and nongovernmental organizations, or NGOs, expect to see in an issuer's Specialized Disclosure, or Form SD, and Conflict Minerals Report, or CMR, if a CMR is deemed necessary.
Technical Library | 2013-05-09 14:35:18.0
Atmospheric dust consists of solids suspended in air. Dust is well known for its complex nature. It normally includes inorganic mineral materials, water soluble salts, organic materials, and a small amount of water. The impact of dust on the reliability of printed circuit board assemblies (PCBAs) is ever-growing, driven by the miniaturization of technology and the increasing un-controlled operating conditions with more dust exposure in telecom and information industries... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2014-10-30 01:48:43.0
The ultimate life of a microelectronics component is often limited by failure of a solder joint due to crack growth through the laminate under a contact pad (cratering), through the intermetallic bond to the pad, or through the solder itself. Whatever the failure mode proper assessments or even relative comparisons of life in service are not possible based on accelerated testing with fixed amplitudes, or random vibration testing, alone. Effects of thermal cycling enhanced precipitate coarsening on the deformation properties can be accounted for by microstructurally adaptive constitutive relations, but separate effects on the rate of recrystallization lead to a break-down in common damage accumulation laws such as Miner's rule. Isothermal cycling of individual solder joints revealed additional effects of amplitude variations on the deformation properties that cannot currently be accounted for directly. We propose a practical modification to Miner's rule for solder failure to circumvent this problem. Testing of individual solder pads, eliminating effects of the solder properties, still showed variations in cycling amplitude to systematically reduce subsequent acceleration factors for solder pad cratering. General trends, anticipated consequences and remaining research needs are discussed
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