Technical Library | 2024-03-19 07:58:40.0
Introduction of Solder Paste Jet Dispensing Machine Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications. Transmission Structure System of Solder Paste Jet Dispensing Machine At the heart of this Solder Paste Jet Dispensing Machine lies a meticulously designed transmission structure system. Powered by X Y linear motor drive control, it achieves unprecedented precision in positioning. With a reciprocating position accuracy of 3σ±5um and a dynamic position accuracy of 3σ±3um across the X, Y, and Z axes, it ensures flawless execution of tasks with minimal deviation. The load-type gantry structure further enhances stability and accuracy, guaranteeing consistent performance even during high-speed operations. Advanced Function Configuration Flexibility and customization are the hallmarks of the Solder Paste Jet Dispensing Machine. It features a customizable platform tailored to meet the specific needs of diverse applications, ensuring optimal performance and efficiency. Additionally, the machine boasts advanced functionalities such as automatic correction of substrate warp height and real-time penetration monitoring. Equipped with dual cameras, it provides precise feedback for adjustments during the filling process, ensuring unmatched precision and quality. Function configuration.jpg Vision Non-stop Experience uninterrupted precision with the Vision Non-stop functionality of this machine. Capable of detecting 100 chips per second, it automatically identifies position and height deviations, enabling real-time compensation for coating actions. Dual compensation for path and glue amount further optimizes efficiency, minimizing waste and maximizing productivity. With its ability to print solder paste dots as small as 110um, it's perfectly suited for high-precision applications in ICs, BGAs, and beyond. Versatility in Configuration Options and Applications Adaptability is key in modern manufacturing, and the Solder Paste Jet Dispensing Machine delivers on all fronts. Offering a range of configuration options, including different valves tailored to various material viscosities and fluidity, it ensures optimal performance across diverse production scenarios. From semiconductor packages to LED back-end Mini-LED production, its versatility knows no bounds, making it an indispensable asset in a wide range of industries. Explore the Future of Manufacturing with I.C.T Join the ranks of industry leaders embracing the future of manufacturing with I.C.T's Solder Paste Jet Dispensing Machine. With its unrivaled precision, speed, and reliability, it's set to revolutionize your production processes and propel your business to new heights of success. Don't just keep up with the competition--surpass it with I.C.T's cutting-edge solutions. Unlock the Potential of Precision Manufacturing Delve deeper into the transformative power of precision manufacturing and discover how the Solder Paste Jet Dispensing Machine can unlock new possibilities for your business. From reducing production costs to improving product quality, the benefits are endless. Partner with I.C.T today and embark on a journey towards manufacturing excellence. Conclusion In conclusion, our Solder Paste Jet Dispensing Machine embodies the fusion of Japanese precision and I.C.T reliability, offering unparalleled efficiency in solder paste dispensing. With its advanced features and customizable options, it caters to the diverse needs of modern manufacturing processes. Experience the pinnacle of dispensing technology with our Solder Paste Jet Dispensing Machine. Overseas Technical Support by I.C.T At I.C.T, our commitment to customer satisfaction extends beyond the initial purchase. We provide comprehensive overseas technical support, including machine installation, debugging, and customer training. Our dedicated team ensures that your production line runs smoothly from the first product off the line to the seamless delivery of the machine. Partner with I.C.T today and elevate your manufacturing precision with our Solder Paste Jet Dispensing Machine. Contact us now to learn more about our solutions and take your production processes to new heights of efficiency and reliability.
Technical Library | 2021-12-03 01:14:19.0
When adjusting the transmitter, please turn off the protection setting, which is usually the red switch in front of the meter and its status may be ON or OFF. If it is ON, you will not be able to make the calibration adjustment.
Technical Library | 2019-01-10 10:24:47.0
We notice that the quantities of material that are to be dosed are becoming more and more divergent. In addition to large media volumes, small and very small quantities are also increasingly coming into focus. For example autonomous driving: These vehicles already produce an immense amount of data today. When potting the associated sensors, cameras, and ECUs, it is important to ensure a precise and repeatable media application – even with volumes of only 0.03 ml. In contrast, when high-voltage batteries for electric cars are potted, 5 to 10 litres of heat-conducting paste are required per vehicle – and the trend is rising. Optical bonding used in display production, on the other hand, is in the medium volume range. The challenge now is to cover the entire volume spectrum reliably and in compliance with the required cycle times. This is remedied by a modular system of scalable modules, which offers the customer the necessary flexibility and enables him to plan a system according to his needs.
Technical Library | 2012-12-12 03:17:51.0
When we designed the PCB equipments, we should try to simplify crcuit and structure design that on the premise of ensuring the equipments to meet the technology and performance, In modern society, modules design (MD)is a effective measures to improved the pcb equipment reliability. The system were made up simpleness functions of modules to reducing the complexity of the design. Both domestic and abroad, a large number of facts have proved this point, MD was a best choice for PCB equipment design.
Technical Library | 2019-01-03 21:34:41.0
With the increase of labor costs, the popularity of automated production lines, • Antistatic ic tubes, connector shipping tubes, power module shipping tubes, LED shipping tubes, relay shipping tubes and other electronic components tubes are also becoming more widely used. Many small companies blindly pursue low-priced packaging materials, and there is no requirement for quality. When it is later discovered that the parts are stuck in the packaging process, they will regret it when they crush the parts during transportation. Shenzhen Sewate Technology Co., Ltd. tells you about six ways to identify quality packaging tubes.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2021-11-03 16:36:36.0
Laser reflow soldering is an important technology in electronic components processing. In this paper, we presented a simple but efficient method to achieve reflow soldering process with gradient energy band created by just two parallel mirrors. The detailed influence of the variety of optical parameters on the soldering process has been analyzed by using the finite element method. And the modulation of the optical parameters on reflow soldering parameters also has been demonstrated. In our experiment, one HR mirror and one-mirror with transmissivity of 10% have been used to create a gradient energy band with an incident laser power of 50W. In summary, both the simulations and the experiments show that the typical reflow soldering profile has been acquired by the optical system. The high quality joints on both the front and rear surface of the capacitor can be acquired by just one surface radiation of the optical system.
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Technical Library | 2016-03-17 19:09:46.0
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the PCB assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework printed circuit boards increases dramatically.Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen printing.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
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