Technical Library | 2016-03-17 19:09:46.0
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the PCB assembly arena. As manufacturers drive to reduce costs while maximizing production by expanding facilities, updating automation equipment, or implementing lean six sigma techniques, the potential to build scrap product or rework printed circuit boards increases dramatically.Manufacturers have two general paths to reduce the costs of high-speed printed circuit board assembly production. The first path is to reduce cost by focusing on high quality printing and mounting. The other, increasingly popular option is to utilize low-cost materials. In either case, the baseline must provide a consistent high-speed solder paste printing method, which considers the fill, snap-off, and cleaning processes.Building on our expertise and testing, this paper will highlight the two trains of thought with specific focus on how low-cost materials affect print performance. It will also explore technologies, which can help provide stable, high-speed screen printing.
Technical Library | 2012-04-12 21:25:13.0
Surface mount technology (SMT) started in the 1960s and became more common in the 1980s. It is the dominant technology in use today. Through-hole technology is still in use, and will be for the foreseeable future, but the drive towards miniaturization of
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The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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