Technical Library: multi and block and pcb (Page 1 of 1)

SMT Manufacturability and Reliability in PCB Cavities

Technical Library | 2012-05-31 18:01:31.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such

AT&S

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Technical Library | 2008-02-26 15:02:19.0

More and more chip packages need multi-GHz RF structures to meet their performance targets. The ideal chip package needs to combine RF features with Digital features for these applications. They drive low-loss, controlled impedance transmission lines, flexibility in assigned signal and power layers, and clearances of various shapes in power layers. Building these features in a chip package is difficult without making the stack-up very thick or compromising the reliability of the product. In the present paper, we have designed and built a flip-chip package test vehicle (TV) to make new RF structures, using Z-axis interconnection (Zinterconnect) building blocks.

i3 Electronics

Advances in Conductive Inks across Multiple Applications and Deposition Platforms

Technical Library | 2012-12-27 14:35:29.0

Printed Electronics is generally defined as the patterning of electronic materials, in solution form, onto flexible substrates, omitting any use of the photolithography, etching, and plating steps commonly found within the Printed Circuit Board (PCB) industry. The origins of printed electronics go back to the 1960s, and close variants of several original applications and market segments remain active today. Through the 1980s and 1990s Printed Electronic applications based on Membrane Touch Switch and Electroluminescent lighting technologies became common, and the screen printed electronic materials used then have formed the building blocks for many of the current and emerging technologies and applications... First published in the 2012 IPC APEX EXPO technical conference proceedings.

DuPont

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