Technical Library: multilayer lamination (Page 1 of 1)

SMT MLCC&SMD resistance parameters and detailed explanation

Technical Library | 2022-04-28 06:42:19.0

I. Chip capacitors(MLCC) The full name of chip capacitors: multilayer (multilayer, laminated) chip ceramic capacitors, also known as chip capacitors, chip capacitance.

Leaderway Industrial Co.,Ltd

Types of flexible printed circuit board

Technical Library | 2012-12-26 20:18:50.0

①Single side The basic flexible printed circuit board is used of substrate of single side pcb materials and coated coverlay after finishing printed. ②Double sided That is made of substrates of double sided printed circuit board with double surface coated coverlays after finishing printed. ③Single copper foil with double coverlays Single copper foil coated different coverlays with double surface after finishing printed. ④Air gap Laminating two single printed circuit board together with no glue and bare design to meet high flexibility requirements. ⑤Multilayer That is designed for three and above circuit layers by laminating single side printed circuit board or double sided printed circuit board. ⑥COF IC chips and electronic components are installed on the flexible circuit board directly. ⑦Rigid-Flexible PCB Combined to rigid PCB with supporting and flexible PCB with high flexibility.

Everest PCB equipment Co.,Ltd

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Technical Library | 2020-01-09 00:00:30.0

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Polymer Competence Center Leoben GmbH

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