Technical Library | 2021-04-15 14:49:27.0
In this study, a predefined template-based image processing system is proposed to automatically detect of PCB soldering defects that negatively affect circuit operation. The proposed system consists of a scaled inspection structure, a camera, an image processing algorithm merged with Fuzzy and template guided inspection process. The prototype is produced using a plastic material, depending on the focal length of the camera and the PCB size. Image processing step comprises two steps. Firstly, solder joints are determined and boxed using Fuzzy C-means clustering algorithm.
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