Technical Library | 2023-11-14 02:36:41.0
Understanding In-Circuit Testing (ICT) with PCBA ICT Testing Machine In-Circuit Testing, commonly known as ICT, stands as a sophisticated and precise method within electronics manufacturing. It serves to evaluate the functionality and integrity of individual electronic components on a Printed Circuit Board (PCB). The process employs specialized equipment called ICT Testers, meticulously designed to pinpoint defects, shorts, opens, and other potential issues within the PCB assembly. The Crucial Role of PCBA ICT Testing Machine 1. Quality Assurance ICT is pivotal in ensuring the overall quality and reliability of electronic products. Early identification and rectification of defects in the production process help manufacturers avoid costly recalls, rework, and post-production issues. 2. Cost-Efficiency ICT significantly reduces manufacturing costs by identifying defects at an early stage. This results in fewer defective units reaching the end of the production line, minimizing waste and rework. 3. Faster Time-to-Market Manufacturers can expedite the production process with ICT by swiftly identifying and resolving issues. This leads to faster product launches, providing a competitive edge in the market. Unveiling the Functions of PCBA ICT Testing Machine The ICT Tester, the core of the In-Circuit Testing process, conducts a battery of tests on each PCB, including: 1. Continuity Testing Checks for open circuits, ensuring all connections are properly established. 2. Component Verification Verifies the presence and orientation of components, ensuring alignment with the PCB design. 3. Functional Testing Some ICT Testers execute functional tests, assessing electronic components' performance as per specifications. 4. Short Testing Identifies unintended connections or shorts between different components on the PCB. 5. Insulation Testing Checks for isolation between different circuits, ensuring no undesired connections or paths. 6. Programming and Configuration In some cases, ICT Testers are used to program and configure specific components on the PCB. Advantages of PCBA ICT Testing Machine 1. High Precision ICT offers unparalleled accuracy in defect detection, making it crucial in modern electronics manufacturing. 2. Speed and Efficiency ICT Testers enable rapid testing, allowing manufacturers to assess a large number of PCBs in a short time. 3. Customization ICT Tests can be tailored to suit specific PCB requirements, ensuring thorough evaluation of every design aspect. 4. Data Collection ICT Testers gather valuable data for process optimization and quality control. In-Circuit Testing (ICT) is fundamental in electronics manufacturing, safeguarding product quality, reducing costs, and accelerating time-to-market. The ICT Tester, with its precision and efficiency, positions manufacturers at the forefront of the highly competitive electronics industry. Embracing ICT is not just a choice; it's a necessity for manufacturers striving for excellence in their products. I.C.T is a leading manufacturer of full SMT line machines in the electronic manufacturing industry. Discover how we can enhance product quality, boost performance, and reduce costs. Contact us at info@smt11.com for reliable global supply, unparalleled efficiency, and superior technical service.
Technical Library | 2024-02-06 14:36:04.0
Quality monitoring for verifiable, high-precision application of adhesives and sealants now begins with detecting the position of the component. Dispensing systems are in continuous use and have to work with 100 percent accuracy. And this level of accuracy must be verifiable. Demands on electronic components continue to escalate as these components also need to operate continuously and flawlessly, especially in the automotive and medical sectors. At the same time, there is increasing pressure to automate as companies are looking to achieve the shortest possible cycle times and maximum output.
Technical Library | 2015-04-02 20:12:58.0
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. According to the iNEMI 2013 placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 um by 2023.This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape. The correlation of deposit diameter and positioning deviation as a function of piezo actuation profile shows that positioning error for deposits increase almost monotonically with decreasing droplet volume irrespective of the piezo-actuation profile. The trends for shape and satellite levels are not as clear and demand further study.
Technical Library | 2013-05-16 15:52:00.0
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free) within the Client Market space (Desktop and Notebook computers) iNEMI initiated a HFR-Free Leadership Workgroup to evaluate the readiness of the Industry to make this transition. The HFR-Free Leadership WG concluded that the electronic industry is ready for the transition and that the key electrical and thermo-mechanical properties of the new HFR-Free laminates can meet the required criteria. The HFR-Free Leadership WG verified that the laminate suppliers can meet the capacity demands for these new HFR-Free laminates and developed a "Test Suite Methodology" (TSM) that can facilitate the comparison and choice of the right laminate to replace brominated FR4 in the Client space... First published in the 2012 IPC APEX EXPO technical conference proceedings.
Technical Library | 2023-11-20 18:10:20.0
The electronics production is prone to a multitude of possible failures along the production process. Therefore, the manufacturing process of surface-mounted electronics devices (SMD) includes visual quality inspection processes for defect detection. The detection of certain error patterns like solder voids and head in pillow defects require radioscopic inspection. These high-end inspection machines, like the X-ray inspection, rely on static checking routines, programmed manually by the expert user of the machine, to verify the quality. The utilization of the implicit knowledge of domain expert(s), based on soldering guidelines, allows the evaluation of the quality. The distinctive dependence on the individual qualification significantly influences false call rates of the inbuilt computer vision routines. In this contribution, we present a novel framework for the automatic solder joint classification based on Convolutional Neural Networks (CNN), flexibly reclassifying insufficient X-ray inspection results. We utilize existing deep learning network architectures for a region of interest detection on 2D grayscale images. The comparison with product-related meta-data ensures the presence of relevant areas and results in a subsequent classification based on a CNN. Subsequent data augmentation ensures sufficient input features. The results indicate a significant reduction of the false call rate compared to commercial X-ray machines, combined with reduced product-related optimization iterations.
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
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Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
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