Technical Library | 2013-10-24 15:47:53.0
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. (...) The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth
Technical Library | 2014-06-23 14:50:52.0
It was unusual to see chip terminations change colors when tin lead solders were used but with the introduction of lead free reflow soldering and the corresponding increases in reflow temperatures terminations are now changing colors. Two conditions are present when reflow temperatures are increased for lead free solder alloys that leads to discoloration. Reflow temperatures are above the melting point of tin (Sn MP is 232oC). Air temperatures commonly used in forced convection reflow systems are high enough to both melt the tin plating on the termination allowing it to be pulled into the solder joint due to solder joint liquid solder surface tension leaving behind the exposed nickel barrier. Now those metal oxide colors will be visible due to high air temperatures during reflow.
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