Technical Library | 2024-02-26 09:08:23.0
Precision Control in Electronic Assembly: Selective Wave Soldering Machine Discover the technical features of I.C.T's Selective Wave Soldering Machines, including precision flux application and innovative preheating systems. Learn how these machines redefine efficiency and reliability in electronic assembly. Introduction: Enhancing Precision Soldering: Technical Features of Selective Wave Soldering Machines by I.C.T Explore the innovative design and operation of I.C.T's Selective Wave Soldering Machines, featuring a seamless PCB handling system and modular design for enhanced assembly line flexibility. Experience precision control and efficiency with comprehensive PC controls, allowing easy adjustment of solder parameters like temperature and flux type. Automatic calibration and CCD mark positioning ensure consistent soldering quality. Detail Excellence: Enhancing Selective Wave Soldering Technology Flux System Mastery German high-frequency pulse injection valve ensures precise flux application. Optional flux nozzle jam detection simplifies maintenance. Pressure tank and precision pressure flow meter ensure consistent flux control. Preheat System Excellence Bottom IR preheating system ensures stability and efficiency. Maintenance is simplified with a tool-free mode and plug-in design. Soldering System Innovation Swedish "PRECIMETER" electromagnetic pump coil ensures stability. Stainless steel soldering pot prevents tin liquid leakage. N2 online heating system reduces solder dross. Transmission System Mastery Specially designed material profiles ensure operational stability. Thickened customized rails guarantee flawless operation. Control and Intelligence Keyence PLC+module high-end bus control system ensures stability. Industry 4.0 compliance allows guided programming and real-time data visualization. Market Promotion and Success Stories: Elevating Selective Wave Soldering Machine I.C.T's strategic market positioning has led to global success across diverse industries. Success stories from European clients highlight reliability and trust in the machine. Over 70 units sold across 20+ countries since 2022, establishing its industry-leading position. Conclusion Conclusion: I.C.T's Selective Wave Soldering Machine combines technical excellence with global market success, solidifying its leadership in precision soldering technology.
Technical Library | 2017-05-17 22:33:43.0
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.
Technical Library | 2014-07-17 17:01:10.0
Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This is intensified by the high ambient conditions experience by today’s modern warfighter. In many applications liquid cooling is replacing air flow through chassis for both thermal and environmental benefits(...) This paper outlines a series of passive thermal improvements which are easily integrated into legacy, or existing, systems and can provide a 3-4x increase in dissipated power.
Technical Library | 2016-12-29 15:37:51.0
The reliabilities of the flux residue of electronic assemblies and semiconductor packages are attracting more and more attention with the adoption of no-clean fluxes by majority of the industry. In recent years, the concern of "partially activated" flux residue and their influence on reliability have been significantly raised due to the miniaturization along with high density design trend, selective soldering process adoption, and the expanded use of pallets in wave soldering process. When flux residue becomes trapped under low stand-off devices, pallets or unsoldered areas (e.g. selective process), it may contain unevaporated solvent, "live" activators and metal complex intermediates with different chemical composition and concentration levels depending on the thermal profiles. These partially-activated residues can directly impact the corrosion, surface insulation and electrochemical migration of the final assembly. In this study, a few application tests were developed internally to understand this issue. Two traditional liquid flux and two newly developed fluxes were selected to build up the basic models. The preliminary results also provide a scientific approach to design highly reliable products with the goal to minimize the reliability risk for the complex PCB designs and assembly processes. This paper was originally published by SMTA in the Proceedings of SMTA International
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