Technical Library | 2021-12-03 01:14:19.0
When adjusting the transmitter, please turn off the protection setting, which is usually the red switch in front of the meter and its status may be ON or OFF. If it is ON, you will not be able to make the calibration adjustment.
Technical Library | 2018-11-14 21:43:14.0
Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned.
Technical Library | 2018-11-22 05:21:52.0
VDR (Voyage Data Recorder) is an instrument continuously recording real-time data of ship body, including speech communication signal of cockpit, sensors data, alarm status and radar images, etc.. So what's types of storage devices may meet VDR's requirement?
Technical Library | 2012-08-23 21:06:35.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In this application, the TBBPA is fully reacted into the epoxy res
Technical Library | 2020-03-12 13:10:35.0
The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
Technical Library | 2015-12-14 13:40:04.0
A Manufacturing Execution System (MES) is a software program that manages and monitors production work in a factory. The MES controls and monitors all manufacturing data in real time, so there is no guesswork as to the status of any given job, machine, operator, etc. The focus is on short-interval scheduling (shift or day) with an emphasis on optimizing the distribution of work orders. Larger manufacturers have employed MES’s for years but many small to medium sized enterprises (SME’s) have yet to adopt such systems. The benefits of using an MES are many. Looking forward, I predict that even the smallest manufacturing companies will employ MES systems in the future.
Technical Library | 2021-08-04 18:36:17.0
In this paper, the existing status of PCB manufacturing environment and future development towards smart manufacturing system (SMS) are discussed. A cloud manufacturing system (CMS) paradigm is introduced in the existing PCB manufacturing environment to get easy access to resources, materials, manufacturing processes, planning problems and data sharing networks. The goal is to integrate the information sharing from planning problems, PCB assembly lines, retailer and shipment department to CMS for smart planning decisions to cope with the increasing demand and profit enhancement strategies. A conceptual framework is presented to introduce the smart manufacturing environment in the traditional PCB manufacturing system. The suggested framework of SMS helps to improve the performance of PCB manufacturing industries regarding smart planning and scheduling, intelligent monitoring of smart assembly lines for efficiency and production enhancement.
Technical Library | 2019-11-12 02:09:22.0
Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com
Technical Library | 2023-06-12 18:33:29.0
This paper presents a real-time predictive approach to improve solder paste stencil printing cycle decision making process in surface mount assembly lines. Stencil cleaning is a critical process that influences the quality and efficiency of printing circuit board. Stencil cleaning operation depends on various process variables, such as printing speed, printing pressure, and aperture shape. The objective of this research is to help efficiently decide stencil printing cleaning cycle by applying data-driven predictive methods. To predict the printed circuit board quality level, a recurrent neural network (RNN) is applied to obtain the printing performance for the different cleaning aging. In the prediction model, not only the previous printing performance statuses are included, but also the printing settings are used to enhance the RNN learning. The model is tested using data collected from an actual solder paste stencil printing line. Based on the predicted printing performance level, the model can help automatically identify the possible cleaning cycle in practice. The results indicate that the proposed model architecture can predictively provide accurate solder paste printing process information to decision makers and increase the quality of the stencil printing process.
Technical Library | 2021-07-27 14:54:26.0
Fast forward to current time. Today, our society embraces cleanliness. We expect, demand, and evaluate cleanliness in almost every aspect of our lives. We wash our cars and pets. We maintain high cleanliness standards in our hotels and public spaces. We require cleanliness in our restaurants and hospitals. We sanitize our hands throughout the day to prevent illness. We live in a clean-centric culture. While we drive clean cars, stay in clean hotels and eat clean food, there is one part of our life where we actually abandoned cleanliness. Many of the circuit assemblies that affect almost every aspect of our daily lives are no longer required to be clean. Even though our life experience confirms the link between cleanliness and reliability, happiness, health, and safety, circuit assemblies no longer maintain that "cleanliness is next to Godliness" status. This was not always the case. There was a time when virtually all circuit assemblies were cleaned. The removal of flux and other process-related contamination was commonplace. Cleaning was as normal as soldering. As we bring history into current time, one may relate the fall of Rome and its adoption of personal hygiene and the subsequent decline in human health to the large-scale abandonment of cleanliness expectations of circuit assemblies and the subsequent reliability issues it has created. How did this happen? Has history repeated itself?
