Technical Library: origin (Page 1 of 4)

Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization

Technical Library | 2017-12-07 10:35:50.0

Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts, tin whiskers, and corrosion at the board level. Within conformal coatings different material chemistries specialize in shielding from an array of hazards and can be applied by multiple methods. The most common method is atomized spray which disperses the material into a fine mist. Alternatively, non-atomized coating controls the materials' dispense shape while maintaining the original liquid form. While some applications demand atomized spray and other scenarios overlap between atomized and non-atomized coating, this paper focuses on the circumstances where materials are ideally suited for non-atomized, selective coating.

ASYMTEK Products | Nordson Electronics Solutions

104132101501 SMT Spare Parts AI Automatic Plug In Machine Accessories

Technical Library | 2022-10-31 08:37:51.0

Brand Name panasonic Model 104132101501 Origin JAPAN Minimum order quantity 1PCS Price negotiable

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Original Panasonic SMT Spare Parts 104691107604 NSC CHUCK 10469S0007

Technical Library | 2022-10-31 08:25:43.0

Material: Iron Model Name: NSC CHUCK Top Quality: 180g Automatic / Manual: Automatic Specification: Original New,copy New Shipping Method: FedEx, DHL, Etc.

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Yamaha Mounter Accessories 6604098 Class I Laser Product CyberOptics Unit Laser

Technical Library | 2022-10-31 09:01:25.0

Delivery Time: 1-2 Days Attributes: Original New Material: Metal Shipping Ways: DHL, FedEx, TNT, UPS, By Sea,DDP Dedicated Line Color: Black Certification: ISO

Shenzhen Zhongrun Hi-Tech Technology Co., Ltd.

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Technical Library | 2010-09-16 18:45:06.0

With PCB complexity and density increasing and also wider use of 3D devices, tougher requirements are now imposed on device inspection both during original manufacture and at their subsequent processing onto printed circuit boards. More complicated and de

Nordson DAGE

Advances in Conductive Inks across Multiple Applications and Deposition Platforms

Technical Library | 2012-12-27 14:35:29.0

Printed Electronics is generally defined as the patterning of electronic materials, in solution form, onto flexible substrates, omitting any use of the photolithography, etching, and plating steps commonly found within the Printed Circuit Board (PCB) industry. The origins of printed electronics go back to the 1960s, and close variants of several original applications and market segments remain active today. Through the 1980s and 1990s Printed Electronic applications based on Membrane Touch Switch and Electroluminescent lighting technologies became common, and the screen printed electronic materials used then have formed the building blocks for many of the current and emerging technologies and applications... First published in the 2012 IPC APEX EXPO technical conference proceedings.

DuPont

Defluxing Déjà vu

Technical Library | 2009-07-29 16:33:01.0

While the origin of the phrase "may you live in interesting times" is widely disputed, the fact that we indeed live in an interesting time is certainly not. While record bank failures and declines in stock values, only rivaled by the Depression era, wreak havoc on consumer confidence, the economic trickle-down effect translates to reductions in production output and ultimately the consolidation of many industries, including electronic assembly.

Aqueous Technologies Corporation

Redundancy Yield Model for SRAMS

Technical Library | 1999-05-07 10:14:57.0

This paper describes a model developed to calculate number of redundant good die per wafer. A block redundancy scheme is used here, where the entire defective memory subarray is replaced by a redundant element. A formula is derived to calculate the amount of improvement expected after redundancy. This improvement is given in terms of the ratio of the overall good die per wafer to the original good die per wafer after considering some key factors.

Intel Corporation

Introducing the OSP Process as an Alternative to HASL

Technical Library | 1999-08-09 11:09:42.0

Organic Solderability Preservatives (OSPs), also known as anti-tarnish, on bare copper printed circuit boards (PCBs) are becoming more prevalent in the electronics industry as the low-cost replacement to Hot Air Solder Leveling (HASL). Introducing the anti-tarnish alternative into the customer sites requires working closely with the coating supplier, assembler, and Original Equipment Manufacturer (OEM) to gain a mutual understanding of respective processing concerns and finished product requirements.

Viasystems Group, Inc.

Printed Circuit Board Tracking with RFID: Speed, Efficiency and Productivity Made Simple.

Technical Library | 2008-05-07 17:54:58.0

Tracking goods through manufacturing was originally accomplished with pencil, paper and human input. Barcodes introduced an automated, machine-readable tracking mechanism that streamlined all types of manufacturing. But modern printed circuit board (PCB) assemblies are running into limitations because of barcode labels. And though barcodes and RFID tags will co-exist, the relatively large barcode labels have to find increasingly scarce real estate on high density boards.

Texas Instruments

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