Technical Library | 2019-08-15 13:31:52.0
Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error.
Technical Library | 2016-10-27 16:24:23.0
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.
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