Technical Library | 2020-11-29 22:02:49.0
It has been over 25 years since the earliest edition of "Everything You Ever Wanted to Know About Laminates...but Were Afraid to Ask" was pounded out on an old TRaSh-80 Computer. It has undergone periodic review and editing, including adaption for use on our website. (When I entered the industry Al Gore had not yet invented the internet.) Before I "retired" in 2004, we did another minor revision, but it was largely cosmetic, removing most references to the old military specification and introducing IPC-4101, the "new" specification for laminate and prepreg materials.
Technical Library | 2014-01-30 18:08:04.0
As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...
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