Technical Library: pal (Page 1 of 1)

Package Converter Compliments Chip Obsolescence

Technical Library | 2011-05-26 19:26:12.0

The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde

Ironwood Electronics

3D IC Development Needs Innovative Socket Solution

Technical Library | 2010-10-07 20:20:58.0

Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions. 3-D packaging can be achieved via die stackin

Ironwood Electronics

Detection of Bare PCB Defects by Image Subtraction Method using Machine Vision

Technical Library | 2011-08-11 20:06:48.0

(Proceedings of the World Congress on Engineering 2011) A Printed Circuit Board (PCB) consists of circuit with electronic components mounted on surface. There are three main steps involved in manufacturing process, where the inspection of PCB is necessar

Sant Longowal Institute of Engineering and Technology (SLIET)

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