Technical Library | 2012-03-08 20:08:57.0
You may have heard talk in the news lately regarding counterfeit electronic components making it into the US military supply chain. The U.S. Senate Armed Services Committee (SASC) recently reported in the Counterfeit Electronic Parts in the Defense Department Supply Chain hearing held on November 17, 2011, 1,800 cases of suspected counterfeit components that went into more than 1 million individual products. If you consider this number for the military, we can only imagine the number of counterfeits in our commercial yet high reliability products, such as life support or other critical systems. If you are the person within your electronics-based company who must perform risk analyses, counterfeiting is not a new concern, yet many do not realize just how good counterfeiters have become at their "trade".
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
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