Technical Library | 2008-06-04 16:10:47.0
The convergence of a wide range of global influences is having a profound effect on current-day quality in manufacturing. Today's operational strategies must take into account business cycles, risk-based management, logistics, workflows, outsourcing, regulatory issues, product development, corporate mergers and acquisitions. In this ever-changing economy it is imperative that companies compete more effectively on two fronts: by reducing costs and emphasizing quality.
Technical Library | 2022-09-29 14:08:42.0
Electronic vehicles, devices and components must not overheat, otherwise they may fail to operate correctly. Thermal management is a major technical challenge as components are getting smaller, power densities are increasing and demands on robustness and reliability are becoming more stringent. To prevent power losses or defects resulting from overheating, liquid thermal interface materials (TIMs) are being increasingly used to dissipate their heat. This White Paper discusses the aspects that need to be taken into account when dispensing these mostly highly viscous, highly abrasive materials and why in many cases they are better alternatives to pads, tapes and foils.
Technical Library | 2021-06-07 19:03:05.0
The waste from end-of-life electrical and electronic equipment has become the fastest growing waste problem in the world. The difficult-to-treat waste-printed circuit boards (WPCBs), which are nearly 3−6 wt % of the total electronic waste, generate great environmental concern nowadays. For WPCB treatment and recycling, the mechanical−physical method has turned out to be more technologically and economically feasible. In this work, the mechanical−physical treatment and recycling technologies for WPCBs were investigated, and future research was directed as well. Removing electric and electronic components(EECs) from WPCBs is critical for their crushing and metal recovery; however, environmentally friendly and high-efficiency removal techniques need be developed. Concentrated metals rich in Cu, Al, Au, Pb, and Sn recovered from WPCBs need be further refined to add to their economic values. The low value added nonmetallic fraction of waste-printed circuit boards (NMF-WPCBs) accounts for approximately 60 wt % of the WPCBs. From the perspective of environmental management, a zero-waste approach to recycling them should be developed to gain values. Preparing polymer composites and geopolymers offers many advantages and has potential applications in various fields, especially as construction and building materials. However, the mechanical and thermal properties of NMF-WPCBs composites should be further improved for preparing polymer composites. Surface modification or filler blending could be applied to improve the interfacial comparability between NMF-WPCBs and the polymer matrix. The NMFWPCBs shows potential in preparing cement mortar and geological polymers, but the environmental safety resulting from metals needs to be taken into account. This study will provide a significant reference for the industrial recycling of NMF-WPCBs
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
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