Technical Library: panasonic any types (Page 1 of 2)

UV Laser PCB Depaneling Machine Improve Cutting Effect

Technical Library | 2021-09-02 08:17:07.0

We are a professional manufacturer of PCB depaneling machines, which is workable for all boards, including flex and regid boards, v-scored boards and routed boards. Laser pcb depaneling is non-contact way without mechanical stress,this solution is good for modern precision PCB depaneling. It has below advantages: 1. No dust The production environment of the circuit board industry is carried out in the dust-free workshop. The traditional pcb depaneling equipment, such as blade moving type machine, will inevitably produce residues and micro powder, which will pollute the 10000 and 1000 class dust-free workshops and affect the conductivity of products. The UV laser PCB cutting machine is a vaporization processing process, which will not produce dust and is conducive to the conductivity of the product. 2. High cutting precision The processing gap of high-precision traditional processing equipment can not reach the gap width of less than 100 microns, which will cause certain damage to the lines on the edge or PCBA circuit board containing components. The focus spot of the laser cutting machine is small, and the ultraviolet cold processing mode has little thermal impact on the edge of the circuit board. The cutting position accuracy is less than 50 microns, and the cutting size accuracy is less than 30 microns, which will not affect the edge of the circuit board, and the precision is high. 3. No stress Traditional processing methods generally have V-grooves, which will cause certain damage to the board in the manufacturing process. The UV laser PCB cutting machine can directly cut the bare board without making V-grooves. In addition, the traditional processing methods directly use tools to act on the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause board deformation. The laser cutting machine is a non-contact processing mode, which acts on the surface of the material through the high-energy beam, which will not cause the influence of stress and the deformation and damage of the circuit board. 4. For special-shaped cutting, it is easy to automate The UV laser PCB cutting machine can cut for any shape without replacing any props and fixtures, and without steel mesh. The same equipment can meet special-shaped and straight-line cutting, which is easy to realize assembly line automatic production and high flexibility. It is easy to improve production efficiency and save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, directly import the drawing, and then locate the cutting. 5. High compatibility The UV laser PCB cutting machine can process the materials around the circuit board, such as PCB, FPC, covering film, pet, reinforcing board, IC, ultra-thin metal cutting, etc. it has strong practicability, is compatible with the processing of a variety of materials, is easy to operate, can be imported into the drawing, does not need to adjust any mechanical parts, and is easy to operate and maintain. 6. Good cutting edge effect The cutting edge is smooth and neat without burr. It can be processed and formed directly according to the size of the drawing, which is conducive to improving the yield of the product. It can be directly installed into the subsequent process without further processing. For more details about UV laser depaneling, please feel free to contact us. www.pcbdepanelingrouter.com

Winsmart Electronic Co.,Ltd

High Precision Laser Cutting

Technical Library | 2024-06-14 21:38:09.0

This type of laser cutting is the most successful and effective practice to achieve quality clean edges and superior products. As opposed to more traditional methods (water jets, punches), laser cutting allows the material to be processed once with extraordinary accuracy and without any other interventions to get a finished piece. It also allows for less waste and is less time consuming, resulting in cleaner production and the ability to manufacture in greater quantities. No matter how complex or straightforward, we achieve the precise, fine cut, details your company needs.

A-Laser, Inc.

AOI Capabilities Study with 03015 Component

Technical Library | 2019-01-23 21:33:32.0

Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process, reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting1-3. Because of this, more Electronic Contract Manufacturing Services (EMS) companies are implementing AOI into their SMT lines to minimize repair costs and maintain good process and product quality, especially for new component types. This project focuses on the testing of component package 03015 which is challenging for AOI.

Flex (Flextronics International)

Bare PCB inspection for Track cut, Track Short and Pad Damage using simple Image Processing Operations

Technical Library | 2021-05-06 13:48:05.0

In this paper most commonly occurring Bare PCB defects such as Track Cut, Track short and Pad Damages are detected by Image processing techniques. Reference PCB without having any defects is compared with test PCB having defects to identify the defects and x-y coordinates of the center of the defects along with radii are obtained using Difference of Gaussian method and location of the individual type of defects are marked either by similar color or different colors. Result Analysis includes time taken for the inspection of a single defect, multiple similar defects, and multiple different defects. Time taken is ranging from 1.674 to 1.714 seconds if the individual type of defects are marked by different colors and 0.670 to 0.709 seconds if all the identified defects are marked by the same colors.

Vidya Vikas Institute Of Engineering And Technology

SELECT CONFORMAL COAT FORMULATION FOR PCB ENVIRONMENT

Technical Library | 2015-08-20 15:51:08.0

Temperature and Humidity on Selective Conformal Coating It is well known that selective conformal coating on printed circuit board (PCB) assemblies provides unparallel protection for PCB’s. Nevertheless, concentrated conditions of humidity, water, and high temperatures can have negative effects on the conformal coating itself causing it to fail and become inapt for its intended purpose. Taking this into consideration, it is prudent to choose the right type of conformal coating that best suits the application and environmental conditions under which an assembly is likely to undergo in use. The proper conformal coating will significantly reduce the likelihood of failure/rejection, saving both valuable time and money for any manufacturing process.

ETS - Energy Technology Systems, Inc.

Cracks: The Hidden Defect

Technical Library | 2019-08-15 13:31:52.0

Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error.

AVX Corporation

Achieving Tight Tolerances

Technical Library | 2024-05-31 19:29:15.0

A tight tolerance machine isn't necessarily a specific machine type. Rather, it's any machine capable of producing parts with precision tolerances. This means minimal variation in the final dimensions of the part. These cutting-edge tools are meticulously engineered to achieve exceptionally precise measurements within minuscule margins. This is accomplished with CNC, or computer numerical control, a manufacturing method that automates the movement of a machine and optimizes for precision. With technology and advanced techniques, these machines ensure that every component meets exact specifications, guaranteeing unparalleled accuracy in manufacturing processes.

A-Laser, Inc.

Printed Circuit Board For Industrial Application Drives a wave of Innovation

Technical Library | 2016-08-02 06:04:42.0

The next generation FUNDAS rest on one and only one motto (i.e.) technology up-gradation. For innovations in any corner of the world, a completely unique electronic solution is derived that accounts for fast trending modernization in the lifestyle of humans. With electronic design or manufacturing solution, the printed circuit boards are the groundwork for every electronic project. As the electronic control system and instruments are now applied in every predominant market across the globe, the use of PCB is predicted to have universal application in the global society. This article details you on the type of PCB’s used in the industrial sector, the application of PCB and innovations marked in the industrial sector with current steps taken by PCB manufacturers to provide unique solutions to the industrial sharks. See more: http://www.technotronix.us/pcbblog/printed-circuit-board-for-industrial-application-drives-a-wave-of-innovation/

Technotronix

NSOP Reduction for QFN RFIC Packages

Technical Library | 2017-08-31 13:43:48.0

Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction

Peregrine Semiconductor

Common Process Defect Identification of QFN Packages

Technical Library | 2019-07-23 22:33:47.0

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.

Nordson DAGE

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