Technical Library | 2008-10-23 15:36:58.0
As part of continuous process improvement at KEMET, most failure modes caused by the capacitor manufacturing process have been systematically eliminated. Today these capacitor manufacturing-related defects are now at a parts per billion (PPB) level. Pareto analysis of customer complaints indicates that the #1 failure mode is IR failure due to flex cracks.
Technical Library | 2019-12-13 00:39:29.0
Salt spray corrosion chamber can test the ability of material and its protective layer to resist salt mist corrosion, or compare the process quality of similar protective layers, at the same time; this equipment is suitable for parts, electronic components, protective layer of metal material and other industrial products. Salt spray test is divided into neutral and acid test. What is the difference between neutral and acid in salt spray test? First, the temperature applied in the test method is different: Neutral test: a. Laboratory:35°C ±1°C, b. Saturated air drums:47°C ±1°C Acid test: a. Laboratory:50°C ±1°C, b. Saturated air drums:63°C ±1°C Second, the production material is different,neutral test chamber adoptes the traditional PVC plates, acid test chamber asopts PP sheet,which is more high temperature resistance and suits strong acid test. Third. Different test methods satisfied Neutral salt spray chamber according to GB/T 2423.17-2008, GB/T 2423.18-2000, salt spray test method and GB/T 10125-1997, GB/T 10587-2006, GB10593.2-1990, GB/T 1765-1979, GB/T 1771-2007, GB/T 12967.388, GB/T 1705.8-2008, etc. In addition to the test methods specified in the national standard, acid salt spray chamber also needs to expand the standard setting such as IEC,MIL,DIN,ASTM,IS,CNS. Last, Comparison of neutral test solutions China: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 United States: distilled water solution NaCI mass concentration 5% ±1% pH value 6.5 ≤ 7.2 Germany: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 Japan: NaCI distilled water solution NaCI mass concentration 5% ±1% pH pH value 6.5 ~ 7.2 France: NaCI distilled water solution NaCI mass concentration 5% pH 6.5 ≤ 7.2 https://climatechambers.com/articles&latestnews/difference-between-neutral-and-acid-salt-spray-corrosion-test.html
Technical Library | 2008-09-04 17:57:24.0
In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB.
Technical Library | 2008-03-25 18:15:54.0
Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly methodology used to implement these devices is fully compatible with existing surface mount approaches. In order to take advantage of these unique characteristics, thin film thermoelectric devices need to be designed for the appropriate thermal and form-factor environments, with system-level constraints carefully considered as an integral part of the overall design process.
Technical Library | 2008-10-29 18:45:53.0
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
Technical Library | 2008-11-20 00:46:10.0
The Sn/Ag/Cu family of alloys is the leading candidate for a lead-free alternative. The first part of this study was to determine if there is any significant difference between Sn/Ag/Cu alloys when used in automatic soldering equipment in terms of copper build-up in the system. The study compared two Sn/Ag/Cu alloys to determine if at processing temperatures one alloy would absorb less copper than the other alloy.
Technical Library | 2008-08-20 17:28:19.0
Kitting is the first step in printed circuit board assembly. It is initiated well in advance of the actual production start to be able to prepare and deliver the kit on time. Kitting involves the gathering of all the parts needed for a particular assembly from the stockroom and issuing the kit to the manufacturing line at the right time and in the right quantity. This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major contract manufacturer site.
Technical Library | 2008-10-01 13:03:00.0
Many Original Equipment Manufacturers, (OEM’s), struggle to continue shipping aging or obsolete electronic products. Electronic products designed five to ten years ago are still relevant in the marketplace. Often these venerable old products have gained particular acceptance amongst a select group of customers. In many cases these old products fulfill a need in a unique manner. Examples include: designs that are grandfathered into an application due to regulatory considerations; designs having unique form-fit-and-function; designs running special software ; designs subject to contractual support and service requirements; designs in which a new contract stipulates delivery of older gear as part of a larger system offering. Any one or all of these reasons can lead an OEM to continue the production of electronic equipment well into its end of useful component life
Technical Library | 2008-12-03 19:39:00.0
This paper presents the analysis from a recent printing study employing a test vehicle that includes components such as 01005s to QFPs. In a recent publication, part of this study was presented focusing on 01005 printing only. This printing process was determined to be suitable for 01005s assembly and also analyzed based on statistical capability. The current paper will present the results from additional detailed analysis to determine if this process has the capability to provide sufficient solder paste deposits for larger components located on the same test board. In the future, the SMT industry may always look towards “Broadband Printing” as an alternative to dual stencil or stepped stencil printing technologies in order to meet the needs of both small and large components.
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