Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2019-04-18 21:53:04.0
IPX9K Rain Spray Test Chamber(high Pressure high temperature water jet) simulates the use of pressure washer steam cleaning onto the enclosure, It is recognised as the harshest of all ingress protection tests. However the requirement is becoming more prevalent across many industries. Test method for IPX9K : Make sure the water temperature inside the water tank +80°C, water flow rate with 14L-16L per min, water pressure: 8000 Kpa -10000 Kpa (80–100 bar) at distance of 100mm~ 150mm, The test duration is 30 seconds in each of 4 angles, total spray testing time is 2 minutes. IPX9 rain test chamber applicable standards: IEC 60529 – Degrees of protection provided by enclosures (IP Code).Here is working principle in picture.
Technical Library | 2019-05-08 01:46:32.0
IPX9K Rain Spray Test Chamber(high Pressure high temperature water jet) simulates the use of pressure washer steam cleaning onto the enclosure, It is recognised as the harshest of all ingress protection tests. However the requirement is becoming more prevalent across many industries. Test method for IPX9K : Make sure the water temperature inside the water tank +80°C, water flow rate with 14L-16L per min, water pressure: 8000 Kpa -10000 Kpa (80–100 bar) at distance of 100mm~ 150mm, The test duration is 30 seconds in each of 4 angles, total spray testing time is 2 minutes. IPX9K rain test chamber applicable standards: IEC 60529 – Degrees of protection provided by enclosures (IP Code).Here is working principle in picture. Application: It is mainly suitable for testing the performance of shell and seal of electrical and electronic parts, automobile parts and seals under the condition of dripping rain to prevent Rain Water from permeating or working after drizzling.
Technical Library | 2023-05-02 18:54:30.0
Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) – that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process.
Technical Library | 2023-05-02 18:50:24.0
Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) – that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process. Given the miniaturized dimensions of an 0201 package, it is crucial that the mounting process abide by a series of guidelines regarding the design of the PCB mounting pads and solderable metallization, PCB circuit trace width, solder paste selection, package placement and overages, solder paste reflow, solder stencil screening, and final inspection. It's advisable that one review this information when procuring the services of a PCB assembler.
Technical Library | 2024-04-29 21:39:52.0
In this paper, we develop and put into practice an Automatic Optical Inspection (AOI) system based on machine vision to check the holes on a printed circuit board (PCB). We incorporate the hardware and software. For the hardware part, we combine a PC, the three-axis positioning system, a lighting device and CCD cameras. For the software part, we utilize image registration, image segmentation, drill numbering, drill contrast, and defect displays to achieve this system. Results indicated that an accuracy of 5µm could be achieved in errors of the PCB holes allowing comparisons to be made. This is significant in inspecting the missing, the multi-hole and the incorrect location of the holes. However, previous work only focusses on one or other feature of the holes. Our research is able to assess multiple features: missing holes, incorrectly located holes and excessive holes. Equally, our results could be displayed as a bar chart and target plot. This has not been achieved before. These displays help users analyze the causes of errors and immediately correct the problems. Additionally, this AOI system is valuable for checking a large number of holes and finding out the defective ones on a PCB. Meanwhile, we apply a 0.1mm image resolution which is better than others used in industry. We set a detecting standard based on 2mm diameter of circles to diagnose the quality of the holes within 10 seconds.
| 1 |
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
