Technical Library | 2017-11-01 17:06:38.0
Over fifteen years has passed since North America and Europe ceased being the center of worldwide PCB fabrication, and were supplanted by a Far East market with low cost labor, more relaxed environmental requirements, and strong government support. In just a few short years, the superior cost advantages of this new dynamic put volume PCB production in the West out of business, aside for the military and specialty technology applications contained in the few shops that continue to exist today.Recently, however, the conditions which created the current equilibrium appear to be shifting again. In this new dynamic, automation, innovative green wastewater technologies, and next generation process equipment innovations have combined to make new factories capable of achieving rapid ROI for PCB fabrication almost anywhere. This paper means to illustrate this new dynamic, and provide case study examples from the new greenfield installation at the company captive facility in New Hampshire.
Technical Library | 2023-07-25 16:42:54.0
Printing solder paste for very small components like .3mm pitch CSP's and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields, SMT Connectors, and large chip or resistor components are also present on the PCB. The smaller components require a stencil thickness typically of 3 mils (75u) to keep the Area Ratio greater than .55 for good paste transfer efficiency. The larger components require either more solder paste height or volume, thus a stencil thickness in the range of 4 to 5 mils (100 to 125u). This paper will explore two stencil solutions to solve this dilemma. The first is a "Two Print Stencil" option where the small component apertures are printed with a thin stencil and the larger components with a thicker stencil with relief pockets for the first print. Successful prints with Keep-Outs as small as 15 mils (400u) will be demonstrated. The second solution is a stencil technology that will provide good paste transfer efficiency for Area Ratio's below .5. In this case a thicker stencil can be utilized to print all components. Paste transfer results for several different stencil types including Laser-Cut Fine Grain stainless steel, Laser-Cut stainless steel with and w/o PTFE Teflon coating, AMTX E-FAB with and w/o PTFE coating for Area Ratios ranging from .4 up to .69.
| 1 |
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
