Technical Library | 2017-06-14 21:33:00.0
Flexible circuitry may be preferable to rigid circuitry in situations where space or weight is limited.
Technical Library | 2011-04-07 14:50:29.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t
Technical Library | 2021-04-01 14:36:51.0
This document provides information about the Surface Mount Technology (SMT) board assembly of Infineon Thin Small Non-leaded Packages (TSNP). The specific dimensions of the leadframe based inner setup depend on the size of the chip and the type of bonding. The field of application ranges from linear voltage regulators for weight-limited applications such as cellular phones and digital cameras to linear voltage regulators for the automotive sector.
Technical Library | 2008-02-04 12:13:38.0
Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.
Technical Library | 2014-08-14 17:58:41.0
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
Technical Library | 2017-08-28 17:14:41.0
PCB suppliers in the automotive space are vastly accelerating their time to market by using automated optical inspection (AOI) systems during PCB assembly. However, this next-generation technique is not limited in scope to the automotive industry – it has powerful implications for the entire PCB industry.
Technical Library | 2021-12-16 01:45:05.0
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
Technical Library | 2008-11-13 00:06:32.0
The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations...
Technical Library | 2024-04-29 21:19:42.0
Over the years, computer vision and machine learning disciplines have considerably advanced the field of automated visual inspection for Printed Circuit Board (PCB-AVI) assurance. However, in practice, the capabilities and limitations of these advancements remain unknown because there are few publicly accessible datasets for PCB visual inspection and even fewer that contain images that simulate realistic application scenarios. To address this need, we propose a publicly available dataset, "FICS-PCB"1, to facilitate the development of robust methods for PCB-AVI. The proposed dataset includes challenging cases from three variable aspects: illumination, image scale, and image sensor. This dataset consists of 9,912 images of 31 PCB samples and contains 77,347 annotated components. This paper reviews the existing datasets and methodologies used for PCBAVI, discusses challenges, describes the proposed dataset, and presents baseline performances using feature engineering and deep learning methods for PCB component classification.
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