Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2009-04-09 20:43:09.0
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life,
Technical Library | 2009-06-11 18:28:24.0
XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. This application note serves as a guide to understanding thermal management of XLamp LEDs and minimizing the effects of elevated junction temperatures.
Technical Library | 2010-05-12 16:21:05.0
Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure.
Technical Library | 2007-09-13 16:58:52.0
With the use of laser light for reflow having been established, all that remains is to apply it to best effect. Each time a laser is fired, it pumps a specific amount of energy at a particular wavelength to a particular point in space. Where technique comes in is choosing where and for how long to apply that light along with the application of accessory equipment to optimize solder paste reflow. This presentation covers the specifics of how to determine which process choices are the right process choices based on the needs of your product to maximize yield and throughput.
Technical Library | 2021-11-03 16:49:59.0
Ultrathin bare die chips were soldered using a novel soldering technology. Using homogeneous flash light generated by high-power xenon flash lamp the dummy components and the bare die NFC chips were successfully soldered to copper tracks on polyimide (PI) and polyethylene terephthalate (PET) flex foils by using industry standard Sn-Ag-Cu lead free alloys. Due to the selectivity of light absorption, a limited temperature increase was observed in the PET substrates while the chip and copper tracks were rapidly heated to a temperatures above the solder melting temperature. This allowed to successfully soldered components onto the delicate polyethylene foil substrates using lead-free alloys with liquidus temperatures above 200 °C. It was shown that by preheating components above the decomposition temperature of solder paste flux with a set of short low intensity pulses the processing window could be significantly extended compared to the process with direct illumination of chips with high intensity flash pulse. Furthermore, it was demonstrated that with localized tuning of pulse intensity components having different heat capacity could be simultaneously soldered using a single flash pulse.
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
Technical Library | 2017-11-15 22:49:14.0
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.
Technical Library | 2021-11-03 17:05:39.0
Additively printed circuits provide advantages in reduced waste, rapid prototyping, and versatile flexible substrate choices relative to conventional circuit printing. Copper (Cu) based inks along with intense pulsed light (IPL) sintering can be used in additive circuit printing. However, IPL sintered Cu typically suffer from poor solderability due to high roughness and porosity. To address this, hybrid Cu ink which consists of Cu precursor/nanoparticle was formulated to seed Cu species and fill voids in the sintered structure. Nickel (Ni) electroplating was utilized to further improve surface solderability. Simulations were performed at various electroplating conditions and Cu cathode surface roughness using the multi-physics finite element method. By utilizing a mask during IPL sintering, conductivity was induced in exposed regions; this was utilized to achieve selective Ni-electroplating. Surface morphology and cross section analysis of the electrodes were observed through scanning electron microscopy and a 3D optical profilometer. Energy dispersive X-ray spectroscopy analysis was conducted to investigate changes in surface compositions. ASTM D3359 adhesion testing was performed to examine the adhesion between the electrode and substrate. Solder-electrode shear tests were investigated with a tensile tester to observe the shear strength between solder and electrodes. By utilizing Cu precursors and novel multifaceted approach of IPL sintering, a robust and solderable Ni electroplated conductive Cu printed electrode was achieved.
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