Technical Library | 2019-09-03 09:52:53.0
The cover tape and the carrier tape are two different products, and many people cannot distinguish the difference between the cover tape and the carrier tape.
Technical Library | 2021-12-08 01:19:32.0
In modern society, mobile phone is almost a necessity for everyone. When your mobile phone is not around, you may easily feel anxious as if something is missing, which is called nomophobia. In the past, people used to check if they had taken money when they went out. But now, mobile phone is the thing people must take. As is known to us, as long as you take a mobile phone, it's easy to get food, clothes, and to take transport. Look at our mobile phones, you will find almost all of them are equipped with touch screens now, which are much better than the early keyboard for using. So, how much do you know about HMI touch screens in industrial scenes?
Technical Library | 2023-07-27 18:41:40.0
Diabetes affects many millions of people worldwide. New technology for real-time glucose measurement replaces the usual unpleasant pricking of a finger: a sensor located in the subcutaneous tissue of the diabetes patient measures the glucose values and transmits them to a receiver. Production of such medical wearables calls for high-precision dispensing systems for applying very small amounts of UV adhesives to medical PCBs and for integrated system concepts to achieve this. A perfect task for Scheugenpflug.
Technical Library | 2014-10-09 17:51:35.0
Over the last years more and more international newspapers reported in Europe / USA and Japan: "Tunnel train got stuck under the Channel – thousands of people stranded", "Recall of thousands of cars to workshops for control and repair", "Power Failures left households without energy for hours." Very often news like this relate to malfunctions of electric and electronic circuits under adverse conditions or sometimes even in normal operating environment (...) The presentation will deal with all kinds of aspect of cleaning to ensure the reliability of electronic circuitry in ever changing operation conditions in the most important industrial areas.
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
Technical Library | 2019-06-06 00:19:02.0
More and more people and things are using electronic devices to communicate. Subsequently, many electronic products, in particular mobile base stations and core network nodes, need to handle enormous amounts of data per second. One important link in this communication chain is high speed pressfit connectors that are often used to connect mother boards and back planes in core network nodes. These new high speed pressfit connectors have several hundreds of thin, short and weak pins that are prone to damage. Small variations in via hole dimensions or hole plating thickness affect the connections; if the holes are too small, the pins may be bentor permanently deformed and if the holes are too large they will not form gas tight connections.The goal of this project was to understand how rework of these new high speed pressfit connectors affects connection strengths, hole wall deformations and plating cracks.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Technical Library | 2020-07-02 13:16:32.0
Principle of shielding 1 The principle of shielding is creating a conductive layer completely surrounding the object you want to shield. This was invented by Michael Faraday and this system is known as a Faraday Cage. 2 Ideally, the shielding layer will be made up of conductive sheets or layers of metal that are connected by means of welding or soldering, without any interruptions. The shielding is perfect when there is no difference in conductivity between the used materials. When dealing with frequencies below 30 MHz, the metal thickness affects shielding effectiveness. We also offer a range of shielding methods for plastic enclosures. A complete absence of interruptions is not a realistic goal since the Faraday cage will have to be opened from time to time so electronics, equipment or people can be moved in or out. Openings are also needed for displays, ventilation, cooling, power supply, signals etc. 3 Shielding works in both directions, items inside the shielded room are shielded from outside influences. (Fig. 3.1)
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
Technical Library | 2019-04-07 23:34:10.0
Ingress Protection Test Chamber is used to determine the protection degree of product enclosures,the protection level provided by the enclosure is called IP code,our IP test chamber compeletely follow the standard IEC60529 and others. IP protection grade is an important index of electrical equipment safety protection. Protective-grade systems such as ip, which provide a method of classifying products in terms of dust-proof, waterproof and anti-collision levels of electrical equipment and packaging, which have been recognized by most European countries, as drafted by the International Electrotechnical Association (iec (international electro technical commission). And announced in ied529 (bs en 60529 / 1992) outer packing protection grade (ip code). The level of protection is expressed in terms of IP followed by two numbers, which are used to define the level of protection. The first number indicates the extent of the equipment‘s resistance to dust, or the degree to which people are protected from harm in sealed environments. I represents a level that prevents solid foreign matter from entering, with a maximum level of 6; The second number indicates the extent to which the equipment is waterproof. P represents the level of protection against influent and the highest level is 8. Such as the protection level of the motor ip65. Contact electrical equipment protection and external material protection level (first digit) Electrical equipment waterproof protection level (second digit) . IP is the international code used to identify the protection grade ip grade consists of two numbers, the first number for dust, and the second number for waterproof, the larger the number means the better protection level.
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