Technical Library | 2009-07-15 12:14:31.0
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines. With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005.
Technical Library | 2021-12-21 23:15:44.0
High Density Interconnect (HDI) technologies are being used widely in Asia and Europe in consumer electronics for portable wireless communication and computing, digital imaging, and chip packaging. Although North America lags behind in developing process capability for this technology, HDI will become a significant business segment for North America. For this to happen, the printed circuit board shops will have to become process capable in fabricating fine lines and spaces, and also be capable in forming and plating microvias.
Technical Library | 2012-11-01 20:54:49.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The continuous progression toward portable, high frequency microelectronic systems has placed high demands on material performance, notably low dielectric constants (Dk), low loss tangent (Df), low moisture uptake, and good thermal stability. Epoxy resins are the workhorses of the electronic industry. Significant performance enhancements have been obtained through the use of PPE telechelic macromonomers with epoxy resins. However, there is a ceiling on the performance obtainable from epoxy-based resins. Therefore, non-epoxy based dielectric materials are used to fulfill the need for higher performance.
Technical Library | 2019-10-30 23:46:39.0
This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. (...) Energy efficiency is a major driver in the evolution of electronics and electronics packaging. To manage power consumption, portable appliances (smartphones, tablets, e-readers etc.) often use multiple supply voltages and DC/DC converters. Most are based on switch mode power conversion (SMPC). In a power converter, inductors and transformers are used to temporarily store energy during switching cycles. They also have the function of filtering noise. The power magnetics are often the largest and most expensive devices in the circuit. Integrating the magnetics into either a power converter module or system board can significantly reduce size and cost of the power converter function.
Technical Library | 2019-12-26 19:13:52.0
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
Technical Library | 2017-02-28 12:39:50.0
During the last 5 years mobile phones and other portable consumer electronics have been extremely popular and spread all over the world in different climate zones in very high volumes. At the same time the mobile phone terminal for many people has become a necessity that is brought with them in any activity they practice. These changes in user behavior have heavily changed the impact on handheld terminals from moisture, sweat, corrosive atmospheres and mechanical drop. As a result of this the requirement to solder joint reliability, corrosion stability and wear resistance are heavily increasing to keep a high reliability of the terminal.Immersion Ni/Au has been the overall dominant surface finish on Printed Wiring Boards (PWB's) for the last 10 years, but a paradigm shift to avoid use of this thin and porous surface finish is ongoing nowadays because it can’t address these challenges in a satisfactory way.In today's handheld terminals, Organic Solder Preservative (OSP) has replaced Immersion Ni/Au on solder pads. Carbon surface finish for Key- and spring contact-pads, combined with the right concept design can make use of Immersion Ni/Au unnecessary in the near future. The result will be higher reliability with less expensive and simpler processes.This paper will discuss the various considerations for choice of surface finish and results from the feasibility studies performed.
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