Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2023-09-18 03:44:40.0
Unleash the art of PCB assembly with our SMT manual printers. Elevate your craftsmanship and achieve precision in solder paste application. Discover our reliable solutions today!
Technical Library | 2023-09-15 10:06:49.0
Enhance your electronics manufacturing with our SMT On-line 3D Solder Paste Inspection Machine. Achieve unmatched precision and accuracy in solder paste inspection for optimal PCB assembly. Streamline your production process and minimize defects with cutting-edge 3D technology. Explore how this machine can revolutionize your soldering process and ensure top-quality electronics.
Technical Library | 2019-05-29 23:10:30.0
There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a "one and done" assembly will be made that there will be some SMT assemblers who choose to hand print solder paste onto the board using a "frameless" stencil. In such cases where hand printing is used, the consistency of the printing technique has typically been in question. Furthermore, the effectiveness of both the nanocoatings as well as the higher end stainless steel materials, which have been heretofore studied in controlled printing environments, will be evaluated for their impact on the hand printing process.The purpose of the study was to determine the effectiveness of select nanocoating materials as well as certain high end stainless steel stencil materials as they relate to the manual SMT printing process. A variety of nanocoatings were applied to SMT metal stencils and solder paste volume measurements were taken to compare the effectiveness.
Technical Library | 2013-07-03 10:31:54.0
It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality.
Technical Library | 2008-10-29 18:45:53.0
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
Technical Library | 2009-12-14 20:27:54.0
Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
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